COSEMANS, Patrick Peter

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COSEMANS, Patrick Peter
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patrick.cosemans@uhasselt.be
 
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Issue DateTitleContributor(s)TypeCat.
12000Electromigration-induced drift in damascene and plasma-etched Al(Cu). I. Kinetics of Cu depletion in polycrystalline interconnectsProost, J; Witvrouw, A; Maex, K; D'HAEN, Jan; COSEMANS, Patrick PeterJournal ContributionA1
21999Stress relaxation in Al-Cu and Al-Si-Cu thin filmsWitvrouw, A; Proost, J; Roussel, P; COSEMANS, Patrick Peter; Maex, KJournal Contribution
31999Dynamics of electromigration induced void/hillock growth and precipitation/dissolution of addition elements studied by in-situ scanning electron microscopy resistance measurementsD'HAEN, Jan; COSEMANS, Patrick Peter; MANCA, Jean; LEKENS, Geert; MARTENS, Tom; DE CEUNINCK, Ward; D'OLIESLAEGER, Marc; DE SCHEPPER, Luc; Maex, KJournal Contribution
41999Microstructurele studie van thermisch- en stroomgedreven processen in A1-gebaseerde on-chip interconnecties m.b.v. elektronenmicroscopieCOSEMANS, Patrick PeterTheses and DissertationsT1
51997Stress relaxation in Al(Cu) thin filmsProost, J.; Witvrouw, A.; COSEMANS, Patrick Peter; Roussel, Ph.; Maex, KarenJournal Contribution
61996Study of the microstructure of IC interconnect metallisations using analytical transmission electron microscopy and secondary ion mass spectrometryCOSEMANS, Patrick Peter; D'OLIESLAEGER, Marc; DE CEUNINCK, Ward; DE SCHEPPER, Luc; STALS, LambertJournal Contribution