VANSTREELS, Kris

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VANSTREELS, Kris

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kris.vanstreels@uhasselt.be

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1 2008
1 2007
1 2005
1 2004

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Type: Journal Contribution

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		Issue Date	Title	Contributor(s)	Type	Cat.
	1	2008	Increasing the mean grain size in copper films and features	VANSTREELS, Kris; Brongersma, S.H.; Tokei, Zs.; Carbonell, L; DE CEUNINCK, Ward; D'HAEN, Jan; D'OLIESLAEGER, Marc	Journal Contribution	A1
	2	2007	Electrical performance, reliability and microstructure of sub-45 nm copper damascene lines fabricated with TEOS backfill	Leaming-Sphabmixay, K.; VAN OLMEN, Jan; Moon, K. J.; VANSTREELS, Kris; D'HAEN, Jan; Tokei, Z.; List, S.; Beyer, G.	Journal Contribution	A1
	3	2005	A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure	VANSTREELS, Kris; D'OLIESLAEGER, Marc; DE CEUNINCK, Ward; D'HAEN, Jan; Maex, Karen	Journal Contribution	A1
	4	2004	MTF test system with AC based dynamic joule correction for electromigration tests on interconnects	BIESEMANS, Leen; Schepers, K; VANSTREELS, Kris; D'HAEN, Jan; DE CEUNINCK, Ward; D'OLIESLAEGER, Marc	Journal Contribution	A1