DE SCHEPPER, Luc

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DE SCHEPPER, Luc
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luc.deschepper@uhasselt.be
 
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Author:  DE CEUNINCK, Ward
Author:  Maex, K
Date Issued:  1998

Results 1-4 of 4 (Search time: 0.002 seconds).

Issue DateTitleContributor(s)TypeCat.
11998The dependence of stress induced voiding on line width studied by conventional and high resolution resistance measurementsWitvrouw, A; Maex, K; DE CEUNINCK, Ward; LEKENS, Geert; D'HAEN, Jan; DE SCHEPPER, LucJournal Contribution
21998The influence of addition elements on the early resistance changes observed during electromigration testing of Al metal linesDE CEUNINCK, Ward; D'Haeger, V; VAN OLMEN, Jan; Witvrouw, A; Maex, K; DE SCHEPPER, Luc; De Pauw, P; Pergoot, AJournal Contribution
31998Overview of the kinetics of the early stages of electromigration under low (= realistic) current density stressVAN OLMEN, Jan; MANCA, Jean; DE CEUNINCK, Ward; DE SCHEPPER, Luc; D'Haeger, V; Witvrouw, A; Maex, KJournal Contribution
41998Study of Cu diffusion in an Al-1 wt%Si-0.5 wt%Cu bond pad with an Al-1 wt%Si bond wire attached using scanning electron microscopyCOSEMANS, Patrick; D'HAEN, Jan; Witvrouw, A; Proost, J; D'OLIESLAEGER, Marc; DE CEUNINCK, Ward; Maex, K; DE SCHEPPER, LucJournal Contribution