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http://hdl.handle.net/1942/11047
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DC Field | Value | Language |
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dc.contributor.author | VAN BAREL, Gregory | - |
dc.contributor.author | Du Bois, Bert | - |
dc.contributor.author | Van Hoof, Rita | - |
dc.contributor.author | De Wachter, Jef | - |
dc.contributor.author | DE CEUNINCK, Ward | - |
dc.contributor.author | Witvrouw, Ann | - |
dc.date.accessioned | 2010-08-03T11:48:54Z | - |
dc.date.available | NO_RESTRICTION | - |
dc.date.available | 2010-08-03T11:48:54Z | - |
dc.date.issued | 2010 | - |
dc.identifier.citation | JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 20 5) | - |
dc.identifier.issn | 0960-1317 | - |
dc.identifier.uri | http://hdl.handle.net/1942/11047 | - |
dc.description.abstract | The apparent and steady-state etch rates of PECVD SiO2, HDP SiO2 and PECVD Si3N4 are measured both in a single thin film and a stacked film configuration. This is done for a HF:H2O/1:1, a HF49 wt%: IPA/1:1 and a BHF solution. It is shown that etch rates vary with the used etch time, confirming the influence of both an incubation and a rinsing period on the average etch rate when performing typical ex situ etch rate experiments. Hence, this second part of a set of two papers provides the experimental evidence for part I where a general etch rate model was proposed. Furthermore this work shows that the etch rate varies whether it is determined on a single layer, in a stacked configuration or while under-etching a structural layer. This confirms the need of a straightforward characterization method for under-etching measurements at the sacrificial release stage of MEMS fabrication processes. Therefore, a new characterization method, using a suspended beam array and a surface profilometer, is proposed to determine the amount of under-etch after sacrificial release of surface micromachined devices. | - |
dc.language.iso | en | - |
dc.publisher | IOP PUBLISHING LTD | - |
dc.title | Apparent and steady-state etch rates in thin film etching and under-etching of microstructures: II. Characterization | - |
dc.type | Journal Contribution | - |
dc.identifier.issue | 5 | - |
dc.identifier.volume | 20 | - |
local.format.pages | 8 | - |
local.bibliographicCitation.jcat | A1 | - |
dc.description.notes | [De Wachter, Jef] Karel de Grote Univ Coll, KdG, B-2660 Hoboken, Belgium. [Van Barel, Gregory; Du Bois, Bert; Van Hoof, Rita; Witvrouw, Ann] IMEC VZW, Interuniv Microelect Ctr, B-3001 Louvain, Belgium. [Van Barel, Gregory; De Ceuninck, Ward] Hasselt Univ, Div Mat Phys, B-3590 Diepenbeek, Belgium. Gregory.VanBarel@kdg.be; Ann.Witvrouw@imec.be | - |
local.type.refereed | Refereed | - |
local.type.specified | Article | - |
dc.bibliographicCitation.oldjcat | A1 | - |
dc.identifier.doi | 10.1088/0960-1317/20/5/055034 | - |
dc.identifier.isi | 000277305000034 | - |
item.fulltext | No Fulltext | - |
item.contributor | VAN BAREL, Gregory | - |
item.contributor | Du Bois, Bert | - |
item.contributor | Van Hoof, Rita | - |
item.contributor | De Wachter, Jef | - |
item.contributor | DE CEUNINCK, Ward | - |
item.contributor | Witvrouw, Ann | - |
item.validation | ecoom 2011 | - |
item.accessRights | Closed Access | - |
item.fullcitation | VAN BAREL, Gregory; Du Bois, Bert; Van Hoof, Rita; De Wachter, Jef; DE CEUNINCK, Ward & Witvrouw, Ann (2010) Apparent and steady-state etch rates in thin film etching and under-etching of microstructures: II. Characterization. In: JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 20 5). | - |
crisitem.journal.issn | 0960-1317 | - |
crisitem.journal.eissn | 1361-6439 | - |
Appears in Collections: | Research publications |
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