Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/2306
Title: A new method for the analysis of high-resolution SILC data
Authors: ARESU, Stefano 
DE CEUNINCK, Ward 
KNUYT, Gilbert 
MERTENS, Johan 
MANCA, Jean 
DE SCHEPPER, Luc 
DEGRAEVE, Maria 
Kaczer, B.
D'OLIESLAEGER, Marc 
D'HAEN, Jan 
Issue Date: 2003
Publisher: PERGAMON-ELSEVIER SCIENCE LTD
Source: MICROELECTRONICS RELIABILITY, 43(9-11). p. 1483-1488
Abstract: Stress-induced Leakage Current (SILC) on ultra-thin SiO2 was measured in-situ by using a high-resolution measurement technique. A broad gate stress voltage range was applied from -2.9 V down to -1.9 V with a voltage step of 0.2 V. The observed current increase corresponds both to an increase in positive charge trapping and to the growth of conduction paths through the oxide. In this article, a new method, based on the Nigam-model is proposed to determine the relevant model parameters. It has been observed that at low voltages the contribution of the charge-trapping component is drastically reduced. (C) 2003 Elsevier Ltd. All rights reserved.
Notes: IMOMEC, IMEC Div, B-3590 Diepenbeek, Belgium. IMEC, B-3001 Heverlee, Belgium. Limburgs Univ Ctr, Inst Mat Res, B-3590 Diepenbeek, Belgium.Aresu, S, IMOMEC, IMEC Div, Wetenschapspk 1, B-3590 Diepenbeek, Belgium.
Document URI: http://hdl.handle.net/1942/2306
ISSN: 0026-2714
e-ISSN: 1872-941X
DOI: 10.1016/S0026-2714(03)00263-4
ISI #: 000185791500023
Category: A1
Type: Journal Contribution
Validations: ecoom 2004
Appears in Collections:Research publications

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