Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/25160
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dc.contributor.authorBASHER, Hassan-
dc.contributor.authorCAROLUS, Jorne-
dc.contributor.authorGevaerts, Veronique-
dc.contributor.authorMEURIS, Marc-
dc.contributor.authorDAENEN, Michael-
dc.date.accessioned2017-11-13T10:20:30Z-
dc.date.available2017-11-13T10:20:30Z-
dc.date.issued2017-
dc.identifier.citation9th edition Sunday 2017, Bussum - The Netherlands, 8/10/2017-
dc.identifier.urihttp://hdl.handle.net/1942/25160-
dc.description.abstractThe connection of the output terminals of thin film photovoltaic (TFPV) modules with a molybdenum (Mo) back contact is challenging because of the molybdenum diselenide (MoSe2) layer which is formed during the selenization process. MoSe2 is known to be highly resistive and previous research showed that high temperature soldering is not favourable for CIGS. In this work, we present the possibilities of ultrasonic bonding in order to create a low resistive and reliable connection of the output terminals.-
dc.language.isoen-
dc.titleUltrasonic bonding of aluminium ribbons to molybdenum back contacted CIGS modules-
dc.typeConference Material-
local.bibliographicCitation.conferencedate8/10/2017-
local.bibliographicCitation.conferencename9th edition Sunday 2017-
local.bibliographicCitation.conferenceplaceBussum - The Netherlands-
local.bibliographicCitation.jcatC2-
local.type.refereedNon-Refereed-
local.type.specifiedPaper-
item.accessRightsOpen Access-
item.fullcitationBASHER, Hassan; CAROLUS, Jorne; Gevaerts, Veronique; MEURIS, Marc & DAENEN, Michael (2017) Ultrasonic bonding of aluminium ribbons to molybdenum back contacted CIGS modules. In: 9th edition Sunday 2017, Bussum - The Netherlands, 8/10/2017.-
item.fulltextWith Fulltext-
item.contributorBASHER, Hassan-
item.contributorCAROLUS, Jorne-
item.contributorGevaerts, Veronique-
item.contributorMEURIS, Marc-
item.contributorDAENEN, Michael-
Appears in Collections:Research publications
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