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http://hdl.handle.net/1942/2782
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DC Field | Value | Language |
---|---|---|
dc.contributor.author | Brongersma, SH | - |
dc.contributor.author | D'HAEN, Jan | - |
dc.contributor.author | VANSTREELS, Kris | - |
dc.contributor.author | DE CEUNINCK, Ward | - |
dc.contributor.author | Vervoort, I | - |
dc.contributor.author | Maex, K | - |
dc.date.accessioned | 2007-11-16T10:16:13Z | - |
dc.date.available | 2007-11-16T10:16:13Z | - |
dc.date.issued | 2003 | - |
dc.identifier.citation | THERMEC'2003, PTS 1-5. p. 2485-2490. | - |
dc.identifier.issn | 0255-5476 | - |
dc.identifier.uri | http://hdl.handle.net/1942/2782 | - |
dc.description.abstract | Electroplated copper has become the method of choice for filling narrow interconnect features in the back-end-of-line processing for microelectronics applications. Through the use of additives a void free deposit can be obtained by inducing a filling from the bottom up. However, the accompanying sub-critical grain size results in a recrystallization that proceeds even at room temperature. This process is strongly dependent on plating conditions and the additives used. The resulting differences are studied through line resistivity and real-time SEM grain growth monitoring at elevated temperatures. The present understanding and our efforts to improve it are presented. | - |
dc.language.iso | en | - |
dc.publisher | TRANS TECH PUBLICATIONS LTD | - |
dc.relation.ispartofseries | MATERIALS SCIENCE FORUM | - |
dc.subject.other | copper; grain growth; real-time SEM | - |
dc.title | Copper deposition and subsequent grain structure evolution in narrow lines | - |
dc.type | Proceedings Paper | - |
local.bibliographicCitation.conferencedate | 2003 | - |
local.bibliographicCitation.conferencename | THERMEC | - |
dc.identifier.epage | 2490 | - |
dc.identifier.spage | 2485 | - |
dc.identifier.volume | 426-4 | - |
local.format.pages | 6 | - |
local.bibliographicCitation.jcat | C1 | - |
dc.description.notes | IMEC, B-3001 Heverlee, Belgium. IMOMEC, B-3590 Diepenbeek, Belgium. Katholieke Univ Leuven, EE Dept, Louvain, Belgium.Brongersma, SH, IMEC, Kapeldreef 75, B-3001 Heverlee, Belgium. | - |
local.type.refereed | Refereed | - |
local.type.specified | Proceedings Paper | - |
dc.bibliographicCitation.oldjcat | C1 | - |
dc.identifier.isi | 000183626400398 | - |
local.bibliographicCitation.btitle | THERMEC'2003, PTS 1-5 | - |
item.fullcitation | Brongersma, SH; D'HAEN, Jan; VANSTREELS, Kris; DE CEUNINCK, Ward; Vervoort, I & Maex, K (2003) Copper deposition and subsequent grain structure evolution in narrow lines. In: THERMEC'2003, PTS 1-5. p. 2485-2490.. | - |
item.accessRights | Closed Access | - |
item.contributor | Brongersma, SH | - |
item.contributor | D'HAEN, Jan | - |
item.contributor | VANSTREELS, Kris | - |
item.contributor | DE CEUNINCK, Ward | - |
item.contributor | Vervoort, I | - |
item.contributor | Maex, K | - |
item.fulltext | No Fulltext | - |
item.validation | ecoom 2004 | - |
Appears in Collections: | Research publications |
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