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http://hdl.handle.net/1942/28579
Title: | Damage-free laser ablation for emitter patterning of silicon heterojunction interdigitated back-contact solar cells | Authors: | Xu, Menglei Bearda, Twan Filipic, Miha Radhakrishnan, Hariharsudan Sivaramakrishnan Debucquoy, Maarten GORDON, Ivan Szlufcik, Jozef POORTMANS, Jef |
Issue Date: | 2017 | Publisher: | IEEE | Source: | 2017 IEEE 44TH PHOTOVOLTAIC SPECIALIST CONFERENCE (PVSC), IEEE,p. 1233-1236 | Series/Report: | IEEE Photovoltaic Specialists Conference | Abstract: | We present a novel process scheme for a-Si:H patterning using damage-free laser ablation, resulting in a simple, fast, and photolithography-free emitter patterning of silicon heterojunction interdigitated back-contact (SHJ-IBC) solar cells. An a-Si:H laser-absorbing layer and a stack of sacrificial dielectric layers are deposited on top of a-Si:H/c-Si heterocontact to prevent laser damage. Laser ablation only removes the top aSi: H layer, which limits laser damage to the surface of dielectric layers. These dielectric layers form a distributed Bragg reflector with a high reflectance of 80% at the laser wavelength which results in additional protection of the bottom a-Si:H/c-Si heterocontact. The significant reduction of laser damage is confirmed by atomic-force microscopy and photo-luminescence measurements. Such damage-free laser ablation process was successfully incorporated in a SHJ-IBC process flow and a best efficiency of 21.8% was achieved. | Notes: | [Xu, Menglei; Poortmans, Jef] Katholieke Univ Leuven, Kasteelpark Arenberg 10, B-3001 Heverlee, Belgium. [Xu, Menglei; Bearda, Twan; Filipic, Miha; Radhakrishnan, Hariharsudan Sivaramakrishnan; Debucquoy, Maarten; Gordon, Ivan; Szlufcik, Jozef; Poortmans, Jef] IMEC, Kapeldreef 75, B-3001 Leuven, Belgium. [Poortmans, Jef] Univ Hasselt, Martelarenlaan 42, B-3500 Hasselt, Belgium. | Keywords: | Energy & Fuels; Engineering, Electrical & Electronic; Materials Science, Multidisciplinary; Physics, Applied | Document URI: | http://hdl.handle.net/1942/28579 | ISBN: | 9781509056057 | ISI #: | 000455636001060 | Rights: | 2017 IEEE | Category: | C1 | Type: | Proceedings Paper |
Appears in Collections: | Research publications |
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