Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/2857
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dc.contributor.authorD'HAEN, Jan-
dc.contributor.authorVAN OLMEN, Jan-
dc.contributor.authorBEELEN, Zjef-
dc.contributor.authorMANCA, Jean-
dc.contributor.authorMARTENS, Tom-
dc.contributor.authorDE CEUNINCK, Ward-
dc.contributor.authorD'OLIESLAEGER, Marc-
dc.contributor.authorDE SCHEPPER, Luc-
dc.contributor.authorCannaerts, M-
dc.contributor.authorMaex, K-
dc.date.accessioned2007-11-20T10:17:35Z-
dc.date.available2007-11-20T10:17:35Z-
dc.date.issued2000-
dc.identifier.citationMICROELECTRONICS RELIABILITY, 40(8-10). p. 1407-1412-
dc.identifier.issn0026-2714-
dc.identifier.urihttp://hdl.handle.net/1942/2857-
dc.description.abstractWith so-called in-situ SEM experiments, electromigration experiments are performed in a SEM (scanning electron microscope) equipped with a heating stage. BSE (back scattered electron) images are taken continuously over the entire length of a metal line submitted to high current and temperature stress, monitoring in detail the microstructure. Comparing the electrical resistance curves with the corresponding SEM micrographs and with ex-situ AFM measurements leads to detailed qualitative and quantitative information about the occurring electromigration and precipitation / dissolution effects in the metal lines. (C) 2000 Elsevier Science Ltd. All rights reserved.-
dc.language.isoen-
dc.publisherPERGAMON-ELSEVIER SCIENCE LTD-
dc.titleIn-situ SEM observation of electromigration in thin metal films at accelerated stress conditions-
dc.typeJournal Contribution-
dc.identifier.epage1412-
dc.identifier.issue8-10-
dc.identifier.spage1407-
dc.identifier.volume40-
local.format.pages6-
local.bibliographicCitation.jcatA1-
dc.description.notesLimburgs Univ Ctr, Inst Mat Res, B-3590 Diepenbeek, Belgium. Katholieke Univ Leuven, B-3001 Heverlee, Belgium. IMEC, B-3001 Heverlee, Belgium.d'Haen, J, Limburgs Univ Ctr, Inst Mat Res, Wetenschapspk, B-3590 Diepenbeek, Belgium.-
local.type.refereedRefereed-
local.type.specifiedArticle-
dc.bibliographicCitation.oldjcatA1-
dc.identifier.doi10.1016/S0026-2714(00)00170-0-
dc.identifier.isi000089532800028-
item.fulltextNo Fulltext-
item.contributorD'HAEN, Jan-
item.contributorVAN OLMEN, Jan-
item.contributorBEELEN, Zjef-
item.contributorMANCA, Jean-
item.contributorMARTENS, Tom-
item.contributorDE CEUNINCK, Ward-
item.contributorD'OLIESLAEGER, Marc-
item.contributorDE SCHEPPER, Luc-
item.contributorCannaerts, M-
item.contributorMaex, K-
item.fullcitationD'HAEN, Jan; VAN OLMEN, Jan; BEELEN, Zjef; MANCA, Jean; MARTENS, Tom; DE CEUNINCK, Ward; D'OLIESLAEGER, Marc; DE SCHEPPER, Luc; Cannaerts, M & Maex, K (2000) In-situ SEM observation of electromigration in thin metal films at accelerated stress conditions. In: MICROELECTRONICS RELIABILITY, 40(8-10). p. 1407-1412.-
item.accessRightsClosed Access-
item.validationecoom 2001-
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