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http://hdl.handle.net/1942/28765
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DC Field | Value | Language |
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dc.contributor.author | NIVELLE, Philippe | - |
dc.contributor.author | BORGERS, Tom | - |
dc.contributor.author | Voroshazi, Eszter | - |
dc.contributor.author | POORTMANS, Jef | - |
dc.contributor.author | D'HAEN, Jan | - |
dc.contributor.author | DE CEUNINCK, Ward | - |
dc.contributor.author | DAENEN, Michael | - |
dc.date.accessioned | 2019-07-19T08:38:13Z | - |
dc.date.available | 2019-07-19T08:38:13Z | - |
dc.date.issued | 2018 | - |
dc.identifier.citation | 2018 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), IEEE, | - |
dc.identifier.isbn | 97815386-54798 | - |
dc.identifier.issn | 1541-7026 | - |
dc.identifier.uri | http://hdl.handle.net/1942/28765 | - |
dc.description.abstract | Encapsulants are known to have a large impact on the reliability of PV modules. Use of new materials such as low temperature solder can have an impact on how the encapsulant behaves in a module throughout its lifetime. A novel test methodology is used in this work to measure the adhesion strength between the encapsulant and its interfaces. The methodology is applied to both plated as screen printed metallization, low temperature SnBiAg solder and thermally evaporated Ag. The first steps in determining the underlying physical phenomena are studied experimentally for these interfaces as they can provide input for reliability models. | - |
dc.description.sponsorship | European Union; European Regional Development Fund ERDF; Province of Limburg; Flanders Innovation & Entrepreneurship | - |
dc.language.iso | en | - |
dc.publisher | IEEE | - |
dc.relation.ispartofseries | International Reliability Physics Symposium | - |
dc.rights | 2018 IEEE | - |
dc.subject.other | Adhesion | - |
dc.subject.other | Encapsulant | - |
dc.subject.other | Reliability | - |
dc.subject.other | Peel test | - |
dc.subject.other | Photovoltaic modules (PV) | - |
dc.title | Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modules | - |
dc.type | Proceedings Paper | - |
local.bibliographicCitation.conferencedate | MAR 11-15, 2018 | - |
local.bibliographicCitation.conferencename | IEEE International Reliability Physics Symposium (IRPS) | - |
local.bibliographicCitation.conferenceplace | Burlingame, CA | - |
local.format.pages | 6 | - |
local.bibliographicCitation.jcat | C1 | - |
dc.description.notes | [Nivelle, Philippe; D'Haen, Jan; Daenen, Michael] Hassell Univ, Martelarenlaan 42, B-3500 Hasselt, Belgium. [Nivelle, Philippe; Borgers, Tom; Voroshazi, Eszter; Poortmans, Jef; De Ceuninck, Ward; Daenen, Michael] IMEC, Kapeldreef 75, B-3001 Heverlee, Belgium. | - |
local.publisher.place | 345 E 47TH ST, NEW YORK, NY 10017 USA | - |
local.type.refereed | Refereed | - |
local.type.specified | Proceedings Paper | - |
dc.identifier.doi | 10.1109/IRPS.2018.8353630 | - |
dc.identifier.isi | 000468959600091 | - |
local.bibliographicCitation.btitle | 2018 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) | - |
local.uhasselt.international | no | - |
item.fullcitation | NIVELLE, Philippe; BORGERS, Tom; Voroshazi, Eszter; POORTMANS, Jef; D'HAEN, Jan; DE CEUNINCK, Ward & DAENEN, Michael (2018) Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modules. In: 2018 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), IEEE,. | - |
item.contributor | NIVELLE, Philippe | - |
item.contributor | BORGERS, Tom | - |
item.contributor | Voroshazi, Eszter | - |
item.contributor | POORTMANS, Jef | - |
item.contributor | D'HAEN, Jan | - |
item.contributor | DE CEUNINCK, Ward | - |
item.contributor | DAENEN, Michael | - |
item.accessRights | Restricted Access | - |
item.fulltext | With Fulltext | - |
Appears in Collections: | Research publications |
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File | Description | Size | Format | |
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Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modules.pdf Restricted Access | Published version | 3.1 MB | Adobe PDF | View/Open Request a copy |
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