Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/30566
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dc.contributor.authorLAMBRICHTS, Mannu-
dc.contributor.authorTIJERINA MUNOZ, Jose Maria-
dc.contributor.authorDE WEYER, Tom-
dc.contributor.authorRAMAKERS, Raf-
dc.date.accessioned2020-02-21T09:03:31Z-
dc.date.available2020-02-21T09:03:31Z-
dc.date.issued2020-
dc.date.submitted2020-02-20T12:29:28Z-
dc.identifier.citationTEI '20: Proceedings of the Fourteenth International Conference on Tangible, Embedded, and Embodied Interaction, ACM, p. 565 -571-
dc.identifier.isbn9781450361071-
dc.identifier.urihttp://hdl.handle.net/1942/30566-
dc.description.abstractWe present a novel DIY fabrication workflow for prototyping highly flexible circuit boards using a laser cutter. As our circuits consist of Kapton and copper, they are highly conductive and thus support high-frequency signals, such as I2C. Key to our approach is a laser machine that supports both a CO2 laser as well as a fiber laser to precisely process respectively Kapton and copper. We also show how the laser cutter can cure soldering paste to realize VIAs (Vertical Interconnect Access) and solder components. In contrast, previous approaches for prototyping flexible PCBs through laser cutting only considered CO2 lasers which can not process metals. Therefore these approaches mainly used ink-based conductors that have a significantly higher electrical resistance than copper.-
dc.language.isoen-
dc.publisherACM-
dc.rightsPermission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the owner/author(s). TEI ’20, February 9–12, 2020, Sydney, NSW, Australia © 2020 Copyright held by the owner/author(s).-
dc.subject.otherFabrication-
dc.subject.otherFlexible PCBs-
dc.subject.otherDIY-
dc.titleDIY Fabrication of High Performance Multi-Layered Flexible PCBs-
dc.typeProceedings Paper-
local.bibliographicCitation.conferencedate9-12 February 2020-
local.bibliographicCitation.conferencenameTEI '20: Fourteenth International Conference on Tangible, Embedded, and Embodied Interaction-
local.bibliographicCitation.conferenceplaceSydney NSW Australia-
dc.identifier.epage571-
dc.identifier.spage565-
local.bibliographicCitation.jcatC1-
local.publisher.placeNew York, NY, United States-
local.type.refereedRefereed-
local.type.specifiedProceedings Paper-
dc.identifier.doi10.1145/3374920.3374988-
dc.identifier.isiWOS:000570009800056-
local.provider.typePdf-
local.bibliographicCitation.btitleTEI '20: Proceedings of the Fourteenth International Conference on Tangible, Embedded, and Embodied Interaction-
local.uhasselt.uhpubyes-
local.uhasselt.internationalno-
item.validationecoom 2021-
item.fulltextWith Fulltext-
item.accessRightsOpen Access-
item.fullcitationLAMBRICHTS, Mannu; TIJERINA MUNOZ, Jose Maria; DE WEYER, Tom & RAMAKERS, Raf (2020) DIY Fabrication of High Performance Multi-Layered Flexible PCBs. In: TEI '20: Proceedings of the Fourteenth International Conference on Tangible, Embedded, and Embodied Interaction, ACM, p. 565 -571.-
item.contributorLAMBRICHTS, Mannu-
item.contributorTIJERINA MUNOZ, Jose Maria-
item.contributorDE WEYER, Tom-
item.contributorRAMAKERS, Raf-
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