Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/30567
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dc.contributor.authorLAMBRICHTS, Mannu-
dc.contributor.authorTIJERINA MUNOZ, Jose Maria-
dc.contributor.authorRAMAKERS, Raf-
dc.date.accessioned2020-02-21T09:19:45Z-
dc.date.available2020-02-21T09:19:45Z-
dc.date.issued2020-
dc.date.submitted2020-02-20T12:26:54Z-
dc.identifier.citationTEI '20: Proceedings of the Fourteenth International Conference on Tangible, Embedded, and Embodied Interaction, ACM, p. 287 -298-
dc.identifier.isbn9781450361071-
dc.identifier.urihttp://hdl.handle.net/1942/30567-
dc.description.abstractWe present SoftMod, a novel modular electronics kit consisting of soft and flexible modules that snap together. Unlike existing modular kits, SoftMod tracks the topology of interconnected modules and supports basic plug-and-play behavior as well as advanced user-specified behavior. As such, the shape of a SoftMod assembly does not depend on the desired behavior and various 2D and 3D electronic systems can be realized. While the plug-and-play nature of our modules stimulates play, the advanced features for specifying behavior and for making a variety of soft and flexible shapes, offer a high-ceiling when experimenting with novel types of interfaces, such as wearables, and interactive skin and textiles. CCS CONCEPTS • Human-centered computing → User interface toolkits. Figure 1: (a) snapping together SoftMods to (b) prototype an interactive armband.-
dc.language.isoen-
dc.publisherACM-
dc.rights2020 Copyright held by the owner/author(s). Publication rights licensed to ACM. Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than the author(s) must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from permissions@acm.org. TEI ’20, February 9–12, 2020, Sydney, NSW, Australia-
dc.subject.otherElectronic Toolkit-
dc.subject.otherSensor Systems-
dc.subject.otherPrototyping-
dc.subject.otherPhysical Computing-
dc.titleSoftMod: A Soft Modular Plug-and-Play Kit for Prototyping Electronic Systems-
dc.typeProceedings Paper-
local.bibliographicCitation.conferencedate2020, February 9-12-
local.bibliographicCitation.conferencename14th International Conference on Tangible, Embedded, and Embodied Interaction (TEI)-
local.bibliographicCitation.conferenceplaceSydney NSW Australia-
dc.identifier.epage298-
dc.identifier.spage287-
local.bibliographicCitation.jcatC1-
local.publisher.place1515 BROADWAY, NEW YORK, NY 10036-9998 USA-
local.type.refereedRefereed-
local.type.specifiedProceedings Paper-
dc.identifier.doi10.1145/3374920.3374950-
dc.identifier.isiWOS:000570009800026-
local.provider.typePdf-
local.bibliographicCitation.btitleTEI '20: Proceedings of the Fourteenth International Conference on Tangible, Embedded, and Embodied Interaction-
local.uhasselt.uhpubyes-
local.uhasselt.internationalno-
item.accessRightsOpen Access-
item.contributorLAMBRICHTS, Mannu-
item.contributorTIJERINA MUNOZ, Jose Maria-
item.contributorRAMAKERS, Raf-
item.validationecoom 2022-
item.fullcitationLAMBRICHTS, Mannu; TIJERINA MUNOZ, Jose Maria & RAMAKERS, Raf (2020) SoftMod: A Soft Modular Plug-and-Play Kit for Prototyping Electronic Systems. In: TEI '20: Proceedings of the Fourteenth International Conference on Tangible, Embedded, and Embodied Interaction, ACM, p. 287 -298.-
item.fulltextWith Fulltext-
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