Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/3253
Full metadata record
DC FieldValueLanguage
dc.contributor.authorDE CEUNINCK, Ward-
dc.contributor.authorMANCA, Jean-
dc.contributor.authorD'Haeger, V-
dc.contributor.authorVAN OLMEN, Jan-
dc.contributor.authorDE SCHEPPER, Luc-
dc.contributor.authorSTALS, Lambert-
dc.date.accessioned2007-11-27T12:49:30Z-
dc.date.available2007-11-27T12:49:30Z-
dc.date.issued1997-
dc.identifier.citationMICROELECTRONICS AND RELIABILITY, 37(12). p. 1813-1816-
dc.identifier.issn0026-2714-
dc.identifier.urihttp://hdl.handle.net/1942/3253-
dc.description.abstractA new test structure has been designed in order to perform accurate early resistance change measurements in metal lines submitted to high current stress. This test structure integrates both advantages of the so-called ''absolute'' and ''bridge'' techniques, resulting in accurate resistance measurements with a high resolution for both the current-stressed and reference strip. Due to the improved measurement configuration, the aging kinetics of a metal line under current stress can be studied in more detail. (C) 1997 Elsevier Science Ltd.-
dc.language.isoen-
dc.publisherElsevier Science Ltd.-
dc.titleDesign of a new test structure for the study of electromigration with early resistance change measurements-
dc.typeJournal Contribution-
dc.identifier.epage1816-
dc.identifier.issue12-
dc.identifier.spage1813-
dc.identifier.volume37-
local.format.pages4-
dc.description.notesDeCeuninck, W, LIMBURG UNIV CTR,INST MAT RES IMO,DIV MAT PHYS,WETENSCHAPSPK,B-3590 DIEPENBEEK,BELGIUM.-
local.type.refereedRefereed-
local.type.specifiedArticle-
dc.bibliographicCitation.oldjcatA1-
dc.identifier.doi10.1016/S0026-2714(97)00014-0-
dc.identifier.isiA1997YJ55000003-
item.fulltextNo Fulltext-
item.contributorDE CEUNINCK, Ward-
item.contributorMANCA, Jean-
item.contributorD'Haeger, V-
item.contributorVAN OLMEN, Jan-
item.contributorDE SCHEPPER, Luc-
item.contributorSTALS, Lambert-
item.fullcitationDE CEUNINCK, Ward; MANCA, Jean; D'Haeger, V; VAN OLMEN, Jan; DE SCHEPPER, Luc & STALS, Lambert (1997) Design of a new test structure for the study of electromigration with early resistance change measurements. In: MICROELECTRONICS AND RELIABILITY, 37(12). p. 1813-1816.-
item.accessRightsClosed Access-
Appears in Collections:Research publications
Show simple item record

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.