Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/3253
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dc.contributor.authorDE CEUNINCK, Ward-
dc.contributor.authorMANCA, Jean-
dc.contributor.authorD'Haeger, V-
dc.contributor.authorVAN OLMEN, Jan-
dc.contributor.authorDE SCHEPPER, Luc-
dc.contributor.authorSTALS, Lambert-
dc.date.accessioned2007-11-27T12:49:30Z-
dc.date.available2007-11-27T12:49:30Z-
dc.date.issued1997-
dc.identifier.citationMICROELECTRONICS AND RELIABILITY, 37(12). p. 1813-1816-
dc.identifier.issn0026-2714-
dc.identifier.urihttp://hdl.handle.net/1942/3253-
dc.description.abstractA new test structure has been designed in order to perform accurate early resistance change measurements in metal lines submitted to high current stress. This test structure integrates both advantages of the so-called ''absolute'' and ''bridge'' techniques, resulting in accurate resistance measurements with a high resolution for both the current-stressed and reference strip. Due to the improved measurement configuration, the aging kinetics of a metal line under current stress can be studied in more detail. (C) 1997 Elsevier Science Ltd.-
dc.language.isoen-
dc.publisherElsevier Science Ltd.-
dc.titleDesign of a new test structure for the study of electromigration with early resistance change measurements-
dc.typeJournal Contribution-
dc.identifier.epage1816-
dc.identifier.issue12-
dc.identifier.spage1813-
dc.identifier.volume37-
local.format.pages4-
dc.description.notesDeCeuninck, W, LIMBURG UNIV CTR,INST MAT RES IMO,DIV MAT PHYS,WETENSCHAPSPK,B-3590 DIEPENBEEK,BELGIUM.-
local.type.refereedRefereed-
local.type.specifiedArticle-
dc.bibliographicCitation.oldjcatA1-
dc.identifier.doi10.1016/S0026-2714(97)00014-0-
dc.identifier.isiA1997YJ55000003-
item.fulltextNo Fulltext-
item.contributorMANCA, Jean-
item.contributorDE CEUNINCK, Ward-
item.contributorDE SCHEPPER, Luc-
item.contributorVAN OLMEN, Jan-
item.contributorD'Haeger, V-
item.contributorSTALS, Lambert-
item.fullcitationDE CEUNINCK, Ward; MANCA, Jean; D'Haeger, V; VAN OLMEN, Jan; DE SCHEPPER, Luc & STALS, Lambert (1997) Design of a new test structure for the study of electromigration with early resistance change measurements. In: MICROELECTRONICS AND RELIABILITY, 37(12). p. 1813-1816.-
item.accessRightsClosed Access-
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