Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/33362
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dc.contributor.authorVAN DYCK, Rik-
dc.contributor.authorBORGERS, Tom-
dc.contributor.authorGOVAERTS, Jonathan-
dc.contributor.authorvan Vuure, Aart Willem-
dc.contributor.authorPOORTMANS, Jef-
dc.date.accessioned2021-02-10T14:35:38Z-
dc.date.available2021-02-10T14:35:38Z-
dc.date.issued2021-
dc.date.submitted2021-02-09T14:23:17Z-
dc.identifier.citationPROGRESS IN PHOTOVOLTAICS, 29 (5) , p. 507-515-
dc.identifier.issn1062-7995-
dc.identifier.urihttp://hdl.handle.net/1942/33362-
dc.description.abstractBack-contact solar cells are an interesting technology with advantages over traditional two-sided cells. A lack of standardized and low-cost interconnection methods inhibits their market penetration. In an attempt to overcome this obstacle, this work introduces an interconnection technology, based on a fabric of encapsulant with incorporated metal ribbons. The encapsulant is tailored for this application by adding glass fibres to a thermoplastic polyolefin. For this tailored encapsulant, characterization experiments were conducted and results on viscosity and coefficient of thermal expansion are shown. Initial reliability testing on sample-size modules with high-efficiency interdigitated back-contact (IBC) cells shows promising results, passing up to four times the IEC 61215 standard for thermal cycling.-
dc.description.sponsorshipFonds Wetenschappelijk Onderzoek, Grant/Award Number: FWO SB PhD Fellowship 1S14120N; Kuwait Foundation for the advancement of Sciences, Grant/Award Number: P115-15EE-01; imec's SiPV industrial affiliation programme The authors gratefully acknowledge Fonds Wetenschappelijk Onderzoek and the FWO SB PhD fellowship funding under project number 1S14120N, imec's SiPV industrial affiliation programme and its partners, and the partial funding by the Kuwait Foundation for the Advancement of Sciences under project number P115-15EE-01. Furthermore, ISC Konstanz is acknowledged for their efforts in supplying cells via the HighLite project and the Department of Materials Engineering from KU Leuven for their assistance during the encapsulant material characterization.-
dc.language.isoen-
dc.publisherWILEY-
dc.rights2021 John Wiley & Sons, Ltd. Free access-
dc.subject.otheradvanced encapsulation materials-
dc.subject.otherback-contact interconnection-
dc.subject.otherPV module-
dc.titleThree-dimensional multi-ribbon interconnection for back-contact solar cells-
dc.typeJournal Contribution-
dc.identifier.epage515-
dc.identifier.issue5-
dc.identifier.spage507-
dc.identifier.volume29-
local.format.pages9-
local.bibliographicCitation.jcatA1-
dc.description.notesVan Dyck, R (corresponding author), Imec, EnergyVille, Thor Pk 8320, B-3600 Genk, Belgium.-
dc.description.notesrik.vandyck@imec.be-
local.publisher.place111 RIVER ST, HOBOKEN 07030-5774, NJ USA-
local.type.refereedRefereed-
local.type.specifiedArticle-
dc.identifier.doi10.1002/pip.3390-
dc.identifier.isi000608431000001-
dc.identifier.eissn1099-159X-
local.provider.typewosris-
local.uhasselt.uhpubyes-
local.description.affiliation[Van Dyck, Rik; Poortmans, Jef; van Vuure, Aart Willem] Katholieke Univ Leuven, Oude Markt 13, B-3000 Leuven, Belgium.-
local.description.affiliation[Van Dyck, Rik; Borgers, Tom; Govaerts, Jonathan; Poortmans, Jef] Imec, Photovolta, Kapeldreef 75, B-3001 Heverlee, Belgium.-
local.description.affiliation[Poortmans, Jef] Univ Hasselt, Martelarenlaan 42, B-3500 Hasselt, Belgium.-
local.uhasselt.internationalno-
item.contributorVAN DYCK, Rik-
item.contributorBORGERS, Tom-
item.contributorGOVAERTS, Jonathan-
item.contributorvan Vuure, Aart Willem-
item.contributorPOORTMANS, Jef-
item.fulltextWith Fulltext-
item.validationecoom 2022-
item.fullcitationVAN DYCK, Rik; BORGERS, Tom; GOVAERTS, Jonathan; van Vuure, Aart Willem & POORTMANS, Jef (2021) Three-dimensional multi-ribbon interconnection for back-contact solar cells. In: PROGRESS IN PHOTOVOLTAICS, 29 (5) , p. 507-515.-
item.accessRightsOpen Access-
crisitem.journal.issn1062-7995-
crisitem.journal.eissn1099-159X-
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