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http://hdl.handle.net/1942/33894
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DC Field | Value | Language |
---|---|---|
dc.contributor.author | BASHER, Hassan | - |
dc.contributor.author | Zulkifli, Muhammad Nubli | - |
dc.contributor.author | Jalar, Azman | - |
dc.contributor.author | DAENEN, Michael | - |
dc.date.accessioned | 2021-04-09T13:25:09Z | - |
dc.date.available | 2021-04-09T13:25:09Z | - |
dc.date.issued | 2021 | - |
dc.date.submitted | 2021-03-30T12:50:27Z | - |
dc.identifier.citation | IEEE Journal of Photovoltaics, 11 (2) , p. 345 -353 | - |
dc.identifier.uri | http://hdl.handle.net/1942/33894 | - |
dc.description.abstract | This article aims to investigate the optimal ultrasonic bonding parameter namely bonding pressure, bonding energy, and bonding amplitude that can minimize the contact resistance (R-c), maximize the peel strength, and identify the possible failure modes of ultrasonic Al bond on Mo back contact layer of copper indium gallium (de)selenide (CIGS) thin-film photovoltaic (TFPV) solar panel. The transmission line method was used to measure R-c and a peel test was carried out to measure the peel strength and the possible failure modes of ultrasonic Al bond on the Mo layer. Design of experiment using D-optimal method was utilized to evaluate the effect of the ultrasonic bonding parameter toward the R-c and peel strength of the Al bond on the Mo layer. Individual and combination of the ultrasonic bonding parameter have a significant effect on the quality of Al bonds on Mo back contact layer of CIGS TFPV solar panel. Possible failure modes could be identified through the application of the higher value of individual ultrasonic bonding parameter while keeping constant other bonding parameters and through the qualitative result of the load-displacement profile obtained from the peel test. However, sample 2 with bonding pressure of 3 bar, bonding energy of 20 Ws, and bonding amplitude of 7.7 mu m is the best-optimized bonding parameter window that can be applied to obtain ultrasonic Al bond with lower R-c and higher peel strength. It was noted that bonding pressure is the most sensitive bonding parameter followed by bonding amplitude and bonding energy. | - |
dc.description.sponsorship | This work was supported in part by the Ministry of Higher Education of Malaysia under the Fundamental Research Grant FRGS/1/2020/TKO/UNIKL/02/10 and in part by the Universiti Kuala Lumpur under Short Term Research under Grant str19087. | - |
dc.language.iso | en | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.subject.other | Acoustics | - |
dc.subject.other | Bonding | - |
dc.subject.other | Solar panels | - |
dc.subject.other | Contact resistance | - |
dc.subject.other | Glass | - |
dc.subject.other | Substrates | - |
dc.subject.other | Shape | - |
dc.subject.other | Copper indium gallium (de)selenide (CIGS) solar panel | - |
dc.subject.other | contact resistance | - |
dc.subject.other | peel strength | - |
dc.subject.other | ultrasonic Al bond | - |
dc.subject.other | ultrasonic bonding failure modes | - |
dc.title | Effect of Ultrasonic Bonding Parameters on the Contact Resistance and Bondability Performances of CIGS Thin Film Photovoltaic Solar Panel | - |
dc.type | Journal Contribution | - |
dc.identifier.epage | 353 | - |
dc.identifier.issue | 2 | - |
dc.identifier.spage | 345 | - |
dc.identifier.volume | 11 | - |
local.format.pages | 9 | - |
local.bibliographicCitation.jcat | A1 | - |
dc.description.notes | Zulkifli, MN (corresponding author), Univ Kuala Lumpur, British Malaysian Inst, Elect Engn Sect, Gombak 53100, Malaysia. | - |
dc.description.notes | yasr_yasr2001@yahoo.com; mnubliz@unikl.edu.my; azmn@ukm.edu.my; | - |
dc.description.notes | michael.daeuen@uhasselt.be | - |
dc.description.other | Zulkifli, MN (corresponding author), Univ Kuala Lumpur, British Malaysian Inst, Elect Engn Sect, Gombak 53100, Malaysia. yasr_yasr2001@yahoo.com; mnubliz@unikl.edu.my; azmn@ukm.edu.my; michael.daeuen@uhasselt.be | - |
local.publisher.place | 445 HOES LANE, PISCATAWAY, NJ 08855-4141 USA | - |
local.type.refereed | Refereed | - |
local.type.specified | Article | - |
dc.identifier.doi | 10.1109/JPHOTOV.2020.3047295 | - |
dc.identifier.isi | WOS:000621413300013 | - |
dc.contributor.orcid | Zulkifli, Muhammad Nubli/0000-0002-3293-3767 | - |
local.provider.type | wosris | - |
local.uhasselt.uhpub | yes | - |
local.description.affiliation | [Basher, Hassan; Zulkifli, Muhammad Nubli] Univ Kuala Lumpur, British Malaysian Inst, Elect Engn Sect, Gombak 53100, Malaysia. | - |
local.description.affiliation | [Jalar, Azman] Univ Kebangsaan Malaysia, Inst Microengn & Nanoelect, Ukm 43600, Selangor, Malaysia. | - |
local.description.affiliation | [Daenen, Michael] Hasselt Univ, Fac Engn Technol, B-3590 Diepenbeek, Belgium. | - |
local.uhasselt.international | yes | - |
item.validation | ecoom 2022 | - |
item.contributor | BASHER, Hassan | - |
item.contributor | Zulkifli, Muhammad Nubli | - |
item.contributor | Jalar, Azman | - |
item.contributor | DAENEN, Michael | - |
item.accessRights | Restricted Access | - |
item.fullcitation | BASHER, Hassan; Zulkifli, Muhammad Nubli; Jalar, Azman & DAENEN, Michael (2021) Effect of Ultrasonic Bonding Parameters on the Contact Resistance and Bondability Performances of CIGS Thin Film Photovoltaic Solar Panel. In: IEEE Journal of Photovoltaics, 11 (2) , p. 345 -353. | - |
item.fulltext | With Fulltext | - |
crisitem.journal.issn | 2156-3381 | - |
crisitem.journal.eissn | 2156-3403 | - |
Appears in Collections: | Research publications |
Files in This Item:
File | Description | Size | Format | |
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09321454.pdf Restricted Access | Published version | 3.65 MB | Adobe PDF | View/Open Request a copy |
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