Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/35904
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dc.contributor.authorMACHIELS, Jarne-
dc.contributor.authorAppeltans, Raf-
dc.contributor.authorBauer, Dieter Klaus-
dc.contributor.authorSegers, Elien-
dc.contributor.authorHenckens, Zander-
dc.contributor.authorVan Rompaey, Wouter-
dc.contributor.authorADONS, Dimitri-
dc.contributor.authorPEETERS, Roos-
dc.contributor.authorGeissler, Marie-
dc.contributor.authorKuehnoel, Katrin-
dc.contributor.authorTempel, Lydia-
dc.contributor.authorWeissbach, Thomas-
dc.contributor.authorHuebler, Arved Carl-
dc.contributor.authorVerma, Akash-
dc.contributor.authorFerraris, Eleonora-
dc.contributor.authorDEFERME, Wim-
dc.contributor.authorBUNTINX, Mieke-
dc.date.accessioned2021-11-26T10:43:39Z-
dc.date.available2021-11-26T10:43:39Z-
dc.date.issued2021-
dc.date.submitted2021-10-28T08:43:36Z-
dc.identifier.citationMaterials, 14 (19) (Art N° 5500)-
dc.identifier.urihttp://hdl.handle.net/1942/35904-
dc.description.abstractIntelligent packaging is an emerging technology, aiming to improve the standard communication function of packaging. Radio frequency identification (RFID) assisted smart packaging is of high interest, but the uptake is limited as the market needs cost-efficient and sustainable applications. The integration of screen printed antennas and RFID chips as smart labels in reusable cardboard packaging could offer a solution. Although paper is an interesting and recyclable material, printing on this substrate is challenging as the ink conductivity is highly influenced by the paper properties. In this study, the best paper/functional silver ink combinations were first selected out of 76 paper substrates based on the paper surface roughness, air permeance, sheet resistance and SEM characterization. Next, a flexible high frequency RFID chip (13.56 MHz) was connected on top of screen printed antennas with a conductive adhesive. Functional RFID labels were integrated in cardboard packaging and its potential application as reusable smart box for third party logistics was tested. In parallel, a web-based software application mimicking its functional abilities in the logistic cycle was developed. This multidisciplinary approach to developing an easy-scalable screen printed antenna and RFID-assisted smart packaging application is a good example for future implementation of hybrid electronics in sustainable smart packaging.</p>-
dc.description.sponsorshipFunding: This study is part of the CORNET project ‘PAPERONICS: Low cost multisensory paper and packaging applications’ (2019–2021). This research was funded by Agentschap Innoveren en Ondernemen, Belgium (VLAIO), grant number HBC.2018.0225, and by Arbeitsgemeinschaft industrieller Forschungsvereinigungen “Otto von Guericke” e.V.) (AiF), grant number IGF-Vorhaben Nr.: 242 EBG. The APC was funded by Hasselt University. Acknowledgments: The authors gratefully acknowledge the financial and technical support of the 34 industrial partners of the PAPERONICS project consortium, in particular FETRA vzw (Brussels, Belgium). The paper substrates were kindly provided by DS Smith (Gent, Belgium), Elep (Lommel, Belgium), FETRA, Grünperga (Grünhainichen, Germany), IDTechEx (Germany), Koehler Paper Group (Oberkirch, Germany), Labeltech (IJsselstein, The Netherlands), Schoeller Technocell (Osnabrück, Germany) and Smurfit Kappa (Oosterhout, The Netherlands). The RFID integration on a label was kindly provided by QUAD Industries (Sint-Niklaas, Belgium) using adhesive of Roartis (Genk, Belgium); the cardboard package fabrication was done by ROPAK bvba (Genk, Belgium); Tape Converters Holland BV (Weert, The Netherlands) supplied transfer tape; and the software development was done in close collaboration with i4CRM (Roosendaal, The Netherlands).-
dc.language.isoen-
dc.publisherMDPI-
dc.rights2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https:// creativecommons.org/licenses/by/ 4.0/).-
dc.subject.otherscreen printing-
dc.subject.otherradio frequency identification (RFID)-
dc.subject.otherantenna-
dc.subject.otherpaper substrate-
dc.subject.otherrecyclability-
dc.subject.otherintelligent packaging-
dc.subject.othere-fulfilment-
dc.subject.othertransport simulation-
dc.titleScreen Printed Antennas on Fiber-Based Substrates for Sustainable HF RFID Assisted E-Fulfilment Smart Packaging-
dc.typeJournal Contribution-
dc.identifier.issue19-
dc.identifier.volume14-
local.format.pages19-
local.bibliographicCitation.jcatA1-
dc.description.notesBuntinx, M (corresponding author), Hasselt Univ, Inst Mat Res IMO IMOMEC, Mat & Packaging Res & Serv, Wetenschapspk 27, B-3590 Diepenbeek, Belgium.; Buntinx, M (corresponding author), IMEC VZW, Div IMOMEC, Wetenschapspk 1, B-3590 Diepenbeek, Belgium.-
dc.description.notesjmachiels@tacon.nl; raf.appeltans@imec.be;-
dc.description.notesklaus.dieter.bauer@ivv.fraunhofer.de; elien.segers@uhasselt.be;-
dc.description.noteszander.henckens@uhasselt.be; wouter.vanrompaey@uhasselt.be;-
dc.description.notesdimitri.adons@uhasselt.be; roos.peeters@uhasselt.be;-
dc.description.notesmarie.geissler@ptspaper.de; Katrin.Kuehnoel@ptspaper.de;-
dc.description.noteslydia.tempel@ptspaper.de; thomas.weissbach@mb.tu-chemnitz.de;-
dc.description.notesarved.huebler@mb.tu-chemnitz.de; akash.verma@kuleuven.be;-
dc.description.noteseleonora.ferraris@kuleuven.be; wim.deferme@uhasselt.be;-
dc.description.notesmieke.buntinx@uhasselt.be-
local.publisher.placeST ALBAN-ANLAGE 66, CH-4052 BASEL, SWITZERLAND-
local.type.refereedRefereed-
local.type.specifiedArticle-
local.bibliographicCitation.artnr5500-
dc.identifier.doi10.3390/ma14195500-
dc.identifier.pmid34639912-
dc.identifier.isiWOS:000707969200001-
dc.contributor.orcidPEETERS, Roos/0000-0001-7515-802X; Buntinx, Mieke/0000-0002-4249-0779-
local.provider.typewosris-
local.uhasselt.uhpubyes-
local.description.affiliation[Machiels, Jarne; Segers, Elien; Henckens, Zander; Van Rompaey, Wouter; Adons, Dimitri; Peeters, Roos; Buntinx, Mieke] Hasselt Univ, Inst Mat Res IMO IMOMEC, Mat & Packaging Res & Serv, Wetenschapspk 27, B-3590 Diepenbeek, Belgium.-
local.description.affiliation[Machiels, Jarne; Segers, Elien; Henckens, Zander; Van Rompaey, Wouter; Deferme, Wim] Hasselt Univ, Inst Mat Res IMO, Funct Mat Engn, Wetenschapspk 1, B-3590 Diepenbeek, Belgium.-
local.description.affiliation[Machiels, Jarne; Deferme, Wim; Buntinx, Mieke] IMEC VZW, Div IMOMEC, Wetenschapspk 1, B-3590 Diepenbeek, Belgium.-
local.description.affiliation[Appeltans, Raf] IMEC VZW, Kapeldreef 75, B-3001 Leuven, Belgium.-
local.description.affiliation[Bauer, Dieter Klaus] Fraunhofer Inst Proc Engn & Packaging IVV, Giggenhauser Str 35, D-85354 Freising Weihenstephan, Germany.-
local.description.affiliation[Geissler, Marie; Kuehnoel, Katrin; Tempel, Lydia] Papiertech Stiftung PTS, Pirnaer Str 37, D-01809 Heidenau, Germany.-
local.description.affiliation[Weissbach, Thomas; Huebler, Arved Carl] Tech Univ Chemnitz, Inst Print & Media Technol, Reichenhainer Str 70, D-09126 Chemnitz, Germany.-
local.description.affiliation[Verma, Akash; Ferraris, Eleonora] Katholieke Univ Leuven, Dept Mech Engn, Mfg Proc & Syst, JD Nayerlaan 5, B-2860 St Katelijne Waver, Belgium.-
local.uhasselt.internationalyes-
item.validationecoom 2022-
item.contributorMACHIELS, Jarne-
item.contributorAppeltans, Raf-
item.contributorBauer, Dieter Klaus-
item.contributorSegers, Elien-
item.contributorHenckens, Zander-
item.contributorVan Rompaey, Wouter-
item.contributorADONS, Dimitri-
item.contributorPEETERS, Roos-
item.contributorGeissler, Marie-
item.contributorKuehnoel, Katrin-
item.contributorTempel, Lydia-
item.contributorWeissbach, Thomas-
item.contributorHuebler, Arved Carl-
item.contributorVerma, Akash-
item.contributorFerraris, Eleonora-
item.contributorDEFERME, Wim-
item.contributorBUNTINX, Mieke-
item.fullcitationMACHIELS, Jarne; Appeltans, Raf; Bauer, Dieter Klaus; Segers, Elien; Henckens, Zander; Van Rompaey, Wouter; ADONS, Dimitri; PEETERS, Roos; Geissler, Marie; Kuehnoel, Katrin; Tempel, Lydia; Weissbach, Thomas; Huebler, Arved Carl; Verma, Akash; Ferraris, Eleonora; DEFERME, Wim & BUNTINX, Mieke (2021) Screen Printed Antennas on Fiber-Based Substrates for Sustainable HF RFID Assisted E-Fulfilment Smart Packaging. In: Materials, 14 (19) (Art N° 5500).-
item.fulltextWith Fulltext-
item.accessRightsOpen Access-
crisitem.journal.eissn1996-1944-
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