PAPERONICS: design and development of HF RFID-assisted smart packaging using hybrid electronics on paper substrates

Abstract

Customer relationship products using printed electronics on fiber-based substrates are still in an early stage of development and applications in the market remain rather limited. Though paper is an interesting biobased and recyclable material, it is a challenging printing substrate because its surface roughness and permeance influence the conductivity of the printing ink. The aim of this study is to design and develop, smart packaging demonstrators by integrating screen printed antennas and RFID chips as smart labels in reusable cardboard packaging. First, the best paper/functional silver ink combinations were selected based on the characterization of the paper surface roughness, air permeability and sheet resistance. Next, antennas were screen printed on selected paper substrates and a flexible high frequency RFID chip (13.56 MHz) was connected on top of the antenna with a conductive adhesive. Functional RFID labels were integrated in cardboard packaging and potential applications were investigated. The findings show that these smart labels can be integrated in warranty packaging for valuable products and in reusable boxes for third party logistics. The functionality and the reliability of the reusable smart boxes was simulated and in parallel a web-based software application that mimics the functional abilities in the complete logistic cycle of this smart box was developed. This study is supported by stakeholders of the smart packaging value chain involved in ink, paper and packaging production; printing, RFID and integration technologies; branding as well as potential end-users. We conclude that this multidisciplinary approach is a good example for future implementation of hybrid electronics in sustainable smart packaging solutions.