Please use this identifier to cite or link to this item:
http://hdl.handle.net/1942/38820Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | BASHER, Hassan | - |
| dc.contributor.author | Zulkifli, Muhammad Nubli | - |
| dc.contributor.author | Jalar, Azman | - |
| dc.contributor.author | DAENEN, Michael | - |
| dc.date.accessioned | 2022-10-27T12:19:11Z | - |
| dc.date.available | 2022-10-27T12:19:11Z | - |
| dc.date.issued | 2022 | - |
| dc.date.submitted | 2022-10-20T11:36:13Z | - |
| dc.identifier.citation | IEEE Journal of Photovoltaics, 12 (6), p. 1418-1427 | - |
| dc.identifier.uri | http://hdl.handle.net/1942/38820 | - |
| dc.description.abstract | This work assesses the bondability and temperature cycling reliability of ultrasonic Al bonds on Molybdenum (Mo) and Molybdenum (di)Selenide (MoSe2) layers of a Copper Indium Gallium (di)Selenide (CIGS) thin-film photovoltaic (TFPV) solar panel. The bondability and reliability of ultrasonic Al bonds were assessed using a qualitative load-displacement profile and quantitative peel force data obtained from a peel test, as well as contact resistance R-c measured using the transmission line method. It was discovered that using the peel test to examine the bondability and reliability of ultrasonic Al bonds and conductive adhesives was quite beneficial. Varied forms of ultrasonic Al bonds and conductive adhesives, either on Mo or MoSe2 layers, have different shapes of load-displacement profiles before and after the application of temperature cycling. Therefore, comparing the load-displacement profile, peel force, and R-c could offer a complete bonding mechanism, failure modes, and failure mechanism for ultrasonic Al bond on MoSe2 and Mo layers of CIGS TFPV solar panels before and after temperature cycling. | - |
| dc.description.sponsorship | Ministry of Higher Education of Malaysia Fundamental Research Grant Scheme (Grant Number: FRGS/1/2020/TKO/UNIKL/02/10) 10.13039/501100009848-Universiti Kuala Lumpur (Grant Number: str19087) | - |
| dc.language.iso | en | - |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
| dc.rights | © 2022 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission. See https://www.ieee.org/publications/rights/index.html for more information. | - |
| dc.subject.other | Acoustics | - |
| dc.subject.other | Solar panels | - |
| dc.subject.other | Conductive adhesives | - |
| dc.subject.other | Lamination | - |
| dc.subject.other | Electrical resistance measurement | - |
| dc.subject.other | Current measurement | - |
| dc.subject.other | Windows | - |
| dc.subject.other | Copper Indium Gallium (di)Selenide (CIGS) solar panel | - |
| dc.subject.other | molybdenum (di)Selenide (MoSe2) layer | - |
| dc.subject.other | molybdenum (Mo) back contact | - |
| dc.subject.other | reliability | - |
| dc.subject.other | ultrasonic Al bond | - |
| dc.title | Temperature Cycling Test on Ultrasonic Aluminum Bonds and Conductive Adhesive of Copper Indium Gallium (di)Selenide (CIGS) Thin-Film Photovoltaic Solar Panel | - |
| dc.type | Journal Contribution | - |
| dc.identifier.epage | 1427 | - |
| dc.identifier.issue | 6 | - |
| dc.identifier.spage | 1418 | - |
| dc.identifier.volume | 12 | - |
| local.bibliographicCitation.jcat | A1 | - |
| dc.description.notes | Zulkifli, MN (corresponding author), Univ Kuala Lumpur, Elect Engn Sect, British Malaysian Inst, Gombak 53100, Malaysia. | - |
| dc.description.notes | yasr_yasr2001@yahoo.com; mnubliz@unikl.edu.my; azmn@ukm.edu.my; | - |
| dc.description.notes | michael.daenen@uhasselt.be | - |
| local.publisher.place | 445 HOES LANE, PISCATAWAY, NJ 08855-4141 USA | - |
| local.type.refereed | Refereed | - |
| local.type.specified | Article | - |
| dc.identifier.doi | 10.1109/JPHOTOV.2022.3209021 | - |
| dc.identifier.isi | 000865071100001 | - |
| local.provider.type | wosris | - |
| local.description.affiliation | [Basher, Hassan; Zulkifli, Muhammad Nubli] Univ Kuala Lumpur, Elect Engn Sect, British Malaysian Inst, Gombak 53100, Malaysia. | - |
| local.description.affiliation | [Jalar, Azman] Univ Kebangsaan Malaysia, Inst Microengn & Nanoelect, Bangi 43600, Malaysia. | - |
| local.description.affiliation | [Daenen, Michael] Hasselt Univ, Fac Engn Technol, Campus Diepenbeek, BE-3590 Diepenbeek, Belgium. | - |
| local.uhasselt.international | yes | - |
| item.fullcitation | BASHER, Hassan; Zulkifli, Muhammad Nubli; Jalar, Azman & DAENEN, Michael (2022) Temperature Cycling Test on Ultrasonic Aluminum Bonds and Conductive Adhesive of Copper Indium Gallium (di)Selenide (CIGS) Thin-Film Photovoltaic Solar Panel. In: IEEE Journal of Photovoltaics, 12 (6), p. 1418-1427. | - |
| item.fulltext | With Fulltext | - |
| item.validation | ecoom 2023 | - |
| item.contributor | BASHER, Hassan | - |
| item.contributor | Zulkifli, Muhammad Nubli | - |
| item.contributor | Jalar, Azman | - |
| item.contributor | DAENEN, Michael | - |
| item.accessRights | Restricted Access | - |
| crisitem.journal.issn | 2156-3381 | - |
| crisitem.journal.eissn | 2156-3403 | - |
| Appears in Collections: | Research publications | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Temperature Cycling Test on Ultrasonic Aluminum Bonds and Conductive Adhesive of Copper Indium Gallium (di)Selenide (CIGS) Thin-Film Photovoltaic Solar Panel.pdf Restricted Access | Published version | 4.5 MB | Adobe PDF | View/Open Request a copy |
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