Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/42657
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dc.contributor.authorVAN DYCK, Rik-
dc.contributor.authorCASASOLA PAESA, Marta-
dc.contributor.authorENGELEN, Tine-
dc.contributor.authorLUO, Bin-
dc.contributor.authorBORGERS, Tom-
dc.contributor.authorGOVAERTS, Jonathan-
dc.contributor.authorSIVARAMAKRISHNAN RADHAKRISHNAN, Hariharsudan-
dc.contributor.authorDAENEN, Michael-
dc.contributor.authorPOORTMANS, Jef-
dc.contributor.authorvan Vuure, Aart Willem-
dc.date.accessioned2024-03-19T15:19:13Z-
dc.date.available2024-03-19T15:19:13Z-
dc.date.issued2023-
dc.date.submitted2024-03-19T07:41:27Z-
dc.identifier.citation2023 IEEE 50TH PHOTOVOLTAIC SPECIALISTS CONFERENCE, PVSC, IEEE, p. 1 -3-
dc.identifier.isbn978-1-6654-6059-0-
dc.identifier.issn0160-8371-
dc.identifier.urihttp://hdl.handle.net/1942/42657-
dc.description.abstractIn this work, two mini-modules using a 3D multiribbon interconnection are fabricated. One with TPO and the other with glass fiber reinforced TPO (GF TPO) encapsulant. Using fiber Braggs grating sensors (FBGS) attached to the cell, in situ temperature and strain are quantified during reliability tests in the form of thermal cycling from -40 degrees C to +85 degrees C. It was found that the temperature of the cell surface reaches -36 degrees C and +81 degrees C at its minimum and maximum respectively. The measured cell strain followed the same cycling behavior between tension and compression. The strain in the GF TPO based module was found to have a lower peak-to-peak (difference between max tension and compression) value. Also, a consistent difference between strain in parallel and perpendicular directions relative to the busbars was observed, with the latter one being larger.-
dc.language.isoen-
dc.publisherIEEE-
dc.relation.ispartofseriesIEEE Photovoltaic Specialists Conference-
dc.rightsCopyright 2024 IEEE - All rights reserved.-
dc.titleAdvanced Encapsulants for Reduced Thermal Mechanical Stress in Photovoltaic Modules: A Quantitative Analysis Using FBGS-
dc.typeProceedings Paper-
local.bibliographicCitation.conferencedateJUN 11-16, 2023-
local.bibliographicCitation.conferencenameIEEE 50th Photovoltaic Specialists Conference (PVSC)-
local.bibliographicCitation.conferenceplaceSan Juan, PR-
dc.identifier.epage3-
dc.identifier.spage1-
local.format.pages3-
local.bibliographicCitation.jcatC1-
dc.description.notesVan Dyck, R (corresponding author), Katholieke Univ Leuven, Leuven, Belgium.; Van Dyck, R (corresponding author), Hasselt Univ, Imo Imomec, Hasselt, Belgium.; Van Dyck, R (corresponding author), Imec, Genk, Belgium.; Van Dyck, R (corresponding author), EnergyVille, Genk, Belgium.-
local.publisher.place345 E 47TH ST, NEW YORK, NY 10017 USA-
local.type.refereedRefereed-
local.type.specifiedProceedings Paper-
dc.identifier.doi10.1109/PVSC48320.2023.10359569-
dc.identifier.isi001151676200045-
local.provider.typewosris-
local.bibliographicCitation.btitle2023 IEEE 50TH PHOTOVOLTAIC SPECIALISTS CONFERENCE, PVSC-
local.description.affiliation[Van Dyck, Rik; Luo, Bin; Poortmans, Jef; van Vuure, Aart Willem] Katholieke Univ Leuven, Leuven, Belgium.-
local.description.affiliation[Van Dyck, Rik; Paesa, Marta Casasola; Engelen, Tine; Luo, Bin; Borgers, Tom; Govaerts, Jonathan; Radhakrishnan, Hariharsudan; Daenen, Michael; Poortmans, Jef] Hasselt Univ, Imo Imomec, Hasselt, Belgium.-
local.description.affiliation[Van Dyck, Rik; Paesa, Marta Casasola; Engelen, Tine; Luo, Bin; Borgers, Tom; Govaerts, Jonathan; Radhakrishnan, Hariharsudan; Daenen, Michael; Poortmans, Jef] Imec, Genk, Belgium.-
local.description.affiliation[Van Dyck, Rik; Paesa, Marta Casasola; Engelen, Tine; Luo, Bin; Borgers, Tom; Govaerts, Jonathan; Radhakrishnan, Hariharsudan; Daenen, Michael; Poortmans, Jef] EnergyVille, Genk, Belgium.-
local.uhasselt.internationalno-
item.fullcitationVAN DYCK, Rik; CASASOLA PAESA, Marta; ENGELEN, Tine; LUO, Bin; BORGERS, Tom; GOVAERTS, Jonathan; SIVARAMAKRISHNAN RADHAKRISHNAN, Hariharsudan; DAENEN, Michael; POORTMANS, Jef & van Vuure, Aart Willem (2023) Advanced Encapsulants for Reduced Thermal Mechanical Stress in Photovoltaic Modules: A Quantitative Analysis Using FBGS. In: 2023 IEEE 50TH PHOTOVOLTAIC SPECIALISTS CONFERENCE, PVSC, IEEE, p. 1 -3.-
item.fulltextNo Fulltext-
item.contributorVAN DYCK, Rik-
item.contributorCASASOLA PAESA, Marta-
item.contributorENGELEN, Tine-
item.contributorLUO, Bin-
item.contributorBORGERS, Tom-
item.contributorGOVAERTS, Jonathan-
item.contributorSIVARAMAKRISHNAN RADHAKRISHNAN, Hariharsudan-
item.contributorDAENEN, Michael-
item.contributorPOORTMANS, Jef-
item.contributorvan Vuure, Aart Willem-
item.accessRightsClosed Access-
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