Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/47987
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dc.contributor.authorKRACK, Max-
dc.contributor.authorPURNAL, Lennert-
dc.contributor.authorSewlikar, Parth Vinayakrao-
dc.contributor.authorCuyvers , Sam-
dc.contributor.authorGEURTS, Gus-
dc.contributor.authorSangma, Rathul Nengminza-
dc.contributor.authorDESTA, Derese-
dc.contributor.authorREENAERS, Dieter-
dc.contributor.authorRUTTENS, Bart-
dc.contributor.authorDe Graeve, Iris-
dc.contributor.authorHauffman, Tom-
dc.contributor.authorTerryn , Seppe-
dc.contributor.authorVanderborght , Bram-
dc.contributor.authorDAENEN, Michael-
dc.contributor.authorDEFERME, Wim-
dc.contributor.authorRAI, MONIKA-
dc.date.accessioned2026-01-06T12:30:32Z-
dc.date.available2026-01-06T12:30:32Z-
dc.date.issued2025-
dc.date.submitted2026-01-05T14:19:20Z-
dc.identifier.citationAdvanced Materials Technologies,-
dc.identifier.urihttp://hdl.handle.net/1942/47987-
dc.description.abstractDirect writing enables rapid prototyping of liquid metal-based stretchable electronics. Challenges, such as printing on uneven surfaces, a limited understanding of the flow behavior, and interfacial issues between liquid metal and electronic terminals for reliable interconnections, remain. We innovatively utilize the kinematic bed of a 3D printer to dynamically control the stand-off distance during direct writing. This enables reliable printing on irregular surfaces and 3D structures with slopes up to 10%. We discover that the thickness of printed liquid metal is affected by a pressure-driven backflow, enabling tuning of thickness in a range of 100 . To solve interfacial challenges, we develop a novel solder-based technique that forms a liquid metal interface on metal coatings, resulting in 100% print reliability between the LM meniscus and the electronic terminal. This interface reduces contact resistance by a factor of four, and improves electrical stability during cyclic strain, with negligible resistance change up to three million cycles. These innovations are demonstrated through the fabrication of large (order of 10 cm) stretchable devices, and stretchable devices featuring integrated electronic components. Our contributions address the limitations of direct writing of liquid metal, advancing the practical realization of reliable, scalable, and fully integrated stretchable electronic systems.-
dc.description.sponsorshipFonds Wetenschappelijk Onderzoek (FWO) [1SH1C24N]; Bijzonder-
dc.language.isoen-
dc.publisherWILEY-
dc.rights2025 The Author(s). Advanced Materials Technologies published by Wiley-VCH GmbH. This is an open access article under the terms of the Creative Commons Attribution-NonCommercial-NoDerivs License, which permits use and distribution in any medium, provided the original work is properly cited, the use is non-commercial and no modifications or adaptations are made.-
dc.subject.otherdirect writing-
dc.subject.otherliquid metal-
dc.subject.otherstretchable electronics-
dc.titleOvercoming Printing and Interfacial Challenges in Liquid Metal Direct Writing for Integrated Stretchable Electronics-
dc.typeJournal Contribution-
local.format.pages12-
local.bibliographicCitation.jcatA1-
dc.description.notesKrack, M (corresponding author), Hasselt Univ, Inst Mat Res, Hasselt, Belgium.; Krack, M (corresponding author), IMEC vzw, Div IMOMEC, Diepenbeek, Belgium.-
dc.description.notesmax.krack@uhasselt.be-
local.publisher.place111 RIVER ST, HOBOKEN, NJ 07030 USA-
local.type.refereedRefereed-
local.type.specifiedArticle-
local.bibliographicCitation.statusEarly view-
dc.identifier.doi10.1002/admt.202502023-
dc.identifier.isi001641611700001-
local.provider.typewosris-
local.description.affiliation[Krack, Maximilian; Purnal, Lennert; Cuyvers, Sam; Geurts, Gus; Desta, Derese; Reenaers, Dieter; Ruttens, Bart; Daenen, Michael; Deferme, Wim; Rai, Monika] Hasselt Univ, Inst Mat Res, Hasselt, Belgium.-
local.description.affiliation[Krack, Maximilian; Purnal, Lennert; Cuyvers, Sam; Geurts, Gus; Desta, Derese; Reenaers, Dieter; Ruttens, Bart; Daenen, Michael; Deferme, Wim; Rai, Monika] IMEC vzw, Div IMOMEC, Diepenbeek, Belgium.-
local.description.affiliation[Sewlikar, Parth Vinayakrao; De Graeve, Iris; Hauffman, Tom; Terryn, Seppe] Vrije Univ Brussel, Mat & Chem & Sustainable Mat Engn, Elsene, Belgium.-
local.description.affiliation[Sangma, Rathul Nengminza; Terryn, Seppe; Vanderborght, Bram] Vrije Univ Brussel, Brubot, Elsene, Belgium.-
local.description.affiliation[Sangma, Rathul Nengminza; Terryn, Seppe; Vanderborght, Bram] IMEC, Elsene, Belgium.-
local.uhasselt.internationalno-
item.fulltextWith Fulltext-
item.contributorKRACK, Max-
item.contributorPURNAL, Lennert-
item.contributorSewlikar, Parth Vinayakrao-
item.contributorCuyvers , Sam-
item.contributorGEURTS, Gus-
item.contributorSangma, Rathul Nengminza-
item.contributorDESTA, Derese-
item.contributorREENAERS, Dieter-
item.contributorRUTTENS, Bart-
item.contributorDe Graeve, Iris-
item.contributorHauffman, Tom-
item.contributorTerryn , Seppe-
item.contributorVanderborght , Bram-
item.contributorDAENEN, Michael-
item.contributorDEFERME, Wim-
item.contributorRAI, MONIKA-
item.accessRightsOpen Access-
item.fullcitationKRACK, Max; PURNAL, Lennert; Sewlikar, Parth Vinayakrao; Cuyvers , Sam; GEURTS, Gus; Sangma, Rathul Nengminza; DESTA, Derese; REENAERS, Dieter; RUTTENS, Bart; De Graeve, Iris; Hauffman, Tom; Terryn , Seppe; Vanderborght , Bram; DAENEN, Michael; DEFERME, Wim & RAI, MONIKA (2025) Overcoming Printing and Interfacial Challenges in Liquid Metal Direct Writing for Integrated Stretchable Electronics. In: Advanced Materials Technologies,.-
crisitem.journal.issn2365-709X-
crisitem.journal.eissn2365-709X-
Appears in Collections:Research publications
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