Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/9045
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dc.contributor.authorVANSTREELS, Kris-
dc.contributor.authorD'OLIESLAEGER, Marc-
dc.contributor.authorDE CEUNINCK, Ward-
dc.contributor.authorD'HAEN, Jan-
dc.contributor.authorMaex, Karen-
dc.date.accessioned2008-12-18T08:37:57Z-
dc.date.available2008-12-18T08:37:57Z-
dc.date.issued2004-
dc.identifier.citation2004 24TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, PROCEEDINGS, VOLS 1 AND 2. p. 633-636.-
dc.identifier.urihttp://hdl.handle.net/1942/9045-
dc.description.abstractSimulation experiments on both series and parallel electromigration (EM) test structures were carried out under current (or voltage) stress and further analysed by means of the Total Resistance (TR) analysis and a software package "failure" in order to calculate and to compare the behaviour of both EM test structures. These simulation experiments show that the parallel EM test structure is a correct approach for the determination of the failure time of submicron interconnects, the activation energy and the current density exponent n of the thermally driven process, therefore leading to a very substantial reduction of the number of samples that are needed to perform the EM tests.-
dc.language.isoen-
dc.publisherIEEE-
dc.titleA new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure-
dc.typeProceedings Paper-
local.bibliographicCitation.conferencename24th International Conference on Microelectronics (MIEL 2004)-
local.bibliographicCitation.conferenceplaceNis, Serbia, MAY 16-19, 2004-
dc.identifier.epage636-
dc.identifier.spage633-
local.format.pages4-
local.bibliographicCitation.jcatC1-
dc.description.notesLimburgs Univ Ctr, IMO, B-3590 Diepenbeek, Belgium.-
local.type.refereedRefereed-
local.type.specifiedProceedings Paper-
dc.bibliographicCitation.oldjcatC1-
dc.identifier.isi000222219300132-
local.bibliographicCitation.btitle2004 24TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, PROCEEDINGS, VOLS 1 AND 2-
item.fulltextNo Fulltext-
item.accessRightsClosed Access-
item.contributorVANSTREELS, Kris-
item.contributorMaex, Karen-
item.contributorDE CEUNINCK, Ward-
item.contributorD'OLIESLAEGER, Marc-
item.contributorD'HAEN, Jan-
item.fullcitationVANSTREELS, Kris; D'OLIESLAEGER, Marc; DE CEUNINCK, Ward; D'HAEN, Jan & Maex, Karen (2004) A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure. In: 2004 24TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, PROCEEDINGS, VOLS 1 AND 2. p. 633-636..-
item.validationecoom 2005-
Appears in Collections:Research publications
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