Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/936
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dc.contributor.authorPost, H.A.-
dc.contributor.authorLetullier, P.-
dc.contributor.authorBriolat, T.-
dc.contributor.authorHumke, R.-
dc.contributor.authorSchuhmann, R.-
dc.contributor.authorSaarinen, K.-
dc.contributor.authorWerner, W.-
dc.contributor.authorOusten, Y.-
dc.contributor.authorLEKENS, Geert-
dc.contributor.authorDehbi, A.-
dc.contributor.authorWondrak, W.-
dc.date.accessioned2006-03-31T06:53:07Z-
dc.date.available2006-03-31T06:53:07Z-
dc.date.issued2005-
dc.identifier.citationMicroelectronics Reliability, 45(9-10). p. 1626-1632-
dc.identifier.issn0026-2714-
dc.identifier.urihttp://hdl.handle.net/1942/936-
dc.description.abstractNew electronic architectures and mechatronic integration in automotive and oil-field applications lead to increasing requirements concerning operating temperatures and vibration levels. At the same time, reliability and lifetime have to fulfil strong demands. In the European funded project PROCURE (Program for the development of passive devices used in rough environments) a generic spectrum of passive components needed for electronic control units has been developed. The failure mechanisms, the technological challenges, and the test requirements are highlighted below.-
dc.format.extent46324 bytes-
dc.format.mimetypeapplication/pdf-
dc.language.isoen-
dc.publisherPERGAMON-ELSEVIER SCIENCE LTD-
dc.subject.otherReliability of electronic components-
dc.titleFailure mechanisms and qualification testing of passive components-
dc.typeJournal Contribution-
dc.identifier.epage1632-
dc.identifier.issue9-10-
dc.identifier.spage1626-
dc.identifier.volume45-
local.bibliographicCitation.jcatA1-
local.type.refereedRefereed-
local.type.specifiedArticle-
dc.bibliographicCitation.oldjcatA1-
dc.identifier.doi10.1016/j.microrel.2005.07.085-
dc.identifier.isi000232253500066-
item.fullcitationPost, H.A.; Letullier, P.; Briolat, T.; Humke, R.; Schuhmann, R.; Saarinen, K.; Werner, W.; Ousten, Y.; LEKENS, Geert; Dehbi, A. & Wondrak, W. (2005) Failure mechanisms and qualification testing of passive components. In: Microelectronics Reliability, 45(9-10). p. 1626-1632.-
item.contributorPost, H.A.-
item.contributorLetullier, P.-
item.contributorBriolat, T.-
item.contributorHumke, R.-
item.contributorSchuhmann, R.-
item.contributorSaarinen, K.-
item.contributorWerner, W.-
item.contributorOusten, Y.-
item.contributorLEKENS, Geert-
item.contributorDehbi, A.-
item.contributorWondrak, W.-
item.fulltextWith Fulltext-
item.accessRightsClosed Access-
crisitem.journal.issn0026-2714-
crisitem.journal.eissn1872-941X-
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