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http://hdl.handle.net/1942/936
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DC Field | Value | Language |
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dc.contributor.author | Post, H.A. | - |
dc.contributor.author | Letullier, P. | - |
dc.contributor.author | Briolat, T. | - |
dc.contributor.author | Humke, R. | - |
dc.contributor.author | Schuhmann, R. | - |
dc.contributor.author | Saarinen, K. | - |
dc.contributor.author | Werner, W. | - |
dc.contributor.author | Ousten, Y. | - |
dc.contributor.author | LEKENS, Geert | - |
dc.contributor.author | Dehbi, A. | - |
dc.contributor.author | Wondrak, W. | - |
dc.date.accessioned | 2006-03-31T06:53:07Z | - |
dc.date.available | 2006-03-31T06:53:07Z | - |
dc.date.issued | 2005 | - |
dc.identifier.citation | Microelectronics Reliability, 45(9-10). p. 1626-1632 | - |
dc.identifier.issn | 0026-2714 | - |
dc.identifier.uri | http://hdl.handle.net/1942/936 | - |
dc.description.abstract | New electronic architectures and mechatronic integration in automotive and oil-field applications lead to increasing requirements concerning operating temperatures and vibration levels. At the same time, reliability and lifetime have to fulfil strong demands. In the European funded project PROCURE (Program for the development of passive devices used in rough environments) a generic spectrum of passive components needed for electronic control units has been developed. The failure mechanisms, the technological challenges, and the test requirements are highlighted below. | - |
dc.format.extent | 46324 bytes | - |
dc.format.mimetype | application/pdf | - |
dc.language.iso | en | - |
dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | - |
dc.subject.other | Reliability of electronic components | - |
dc.title | Failure mechanisms and qualification testing of passive components | - |
dc.type | Journal Contribution | - |
dc.identifier.epage | 1632 | - |
dc.identifier.issue | 9-10 | - |
dc.identifier.spage | 1626 | - |
dc.identifier.volume | 45 | - |
local.bibliographicCitation.jcat | A1 | - |
local.type.refereed | Refereed | - |
local.type.specified | Article | - |
dc.bibliographicCitation.oldjcat | A1 | - |
dc.identifier.doi | 10.1016/j.microrel.2005.07.085 | - |
dc.identifier.isi | 000232253500066 | - |
item.fulltext | With Fulltext | - |
item.accessRights | Open Access | - |
item.contributor | Post, H.A. | - |
item.contributor | Letullier, P. | - |
item.contributor | Briolat, T. | - |
item.contributor | Humke, R. | - |
item.contributor | Schuhmann, R. | - |
item.contributor | Saarinen, K. | - |
item.contributor | Werner, W. | - |
item.contributor | Ousten, Y. | - |
item.contributor | LEKENS, Geert | - |
item.contributor | Dehbi, A. | - |
item.contributor | Wondrak, W. | - |
item.fullcitation | Post, H.A.; Letullier, P.; Briolat, T.; Humke, R.; Schuhmann, R.; Saarinen, K.; Werner, W.; Ousten, Y.; LEKENS, Geert; Dehbi, A. & Wondrak, W. (2005) Failure mechanisms and qualification testing of passive components. In: Microelectronics Reliability, 45(9-10). p. 1626-1632. | - |
crisitem.journal.issn | 0026-2714 | - |
crisitem.journal.eissn | 1872-941X | - |
Appears in Collections: | Research publications |
Files in This Item:
File | Description | Size | Format | |
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704 Microelectr. Reliab. LEKG.pdf | 45.24 kB | Adobe PDF | View/Open |
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