NIVELLE, Philippe

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NIVELLE, Philippe
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philippe.nivelle@uhasselt.be
 
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Publications

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Author:  VAN DYCK, Rik

Results 1-4 of 4 (Search time: 0.002 seconds).

Issue DateTitleContributor(s)TypeCat.
12020Encapsulant-Integrated Interconnection of Bifacial Solar Cells for BIPV Applications: Latest Results in the Twill-BIPV ProjectGOVAERTS, Jonathan; BORGERS, Tom; VAN DYCK, Rik; Andries, Nick; Meyers, Pieter; VAN DER HEIDE, Arvid; Vastmans, Luc; Moors, Reinoud; Doumen, Geert; NIVELLE, Philippe; DAENEN, Michael; Voroshazi, Eszter; Arnett, Chad; Labie, Riet; Van Den Storme, Manuel; Van Den Storme, Guy; Vandebroek, Steven; Schroyen, Peter; Smeers, Kris; Vavilkin, Tatjana; Dewallef, Stefan; Abgrall, Florent; Jousset, Dominique; POORTMANS, JefProceedings PaperC1
22019Interconnection 1, 2, 3, 4.0: Buildup towards a PV Technology Hero?BORGERS, Tom; GOVAERTS, Jonathan; VAN DYCK, Rik; El -Chami, Ibrahim; NIVELLE, Philippe; VAN DER HEIDE, Arvid; Doumen, Geert; Bervoets, Robert; Vastmans, Luc; Moors, Reinoud; Manganiello, Patrizio; Voroshazi, Eszter; Szlufcik, Jozef; POORTMANS, JefProceedings PaperC2
32018Multi-wire interconnection: The impact of the lamination process and the encapsulant properties on the solder joint formationVAN DYCK, Rik; BORGERS, Tom; GOVAERTS, Jonathan; NIVELLE, Philippe; VAN DER HEIDE, Arvid; De Jonge, S.; Voroshazi, Eszter; Szlufcik, Jozef; Van Vuure, Aart Willem; POORTMANS, JefProceedings PaperC1
42018Progress in Encapsulant-Integrated Multi-Wire InterconnectionGOVAERTS, Jonathan; BORGERS, Tom; NIVELLE, Philippe; VAN DYCK, Rik; El-Chami, Ibrahim; Issa, Ibrahim; Hoogewijs, Tom; VAN DER HEIDE, Arvid; Voroshazi, Eszter; Szlufcik, Jozef; POORTMANS, JefProceedings PaperC2