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Title: | Encapsulant-Integrated Interconnection of Bifacial Solar Cells for BIPV Applications: Latest Results in the Twill-BIPV Project | Authors: | GOVAERTS, Jonathan BORGERS, Tom VAN DYCK, Rik Andries, Nick Meyers, Pieter VAN DER HEIDE, Arvid Vastmans, Luc Moors, Reinoud Doumen, Geert NIVELLE, Philippe DAENEN, Michael Voroshazi, Eszter Arnett, Chad Labie, Riet Van Den Storme, Manuel Van Den Storme, Guy Vandebroek, Steven Schroyen, Peter Smeers, Kris Vavilkin, Tatjana Dewallef, Stefan Abgrall, Florent Jousset, Dominique POORTMANS, Jef |
Issue Date: | 2020 | Source: | Proceedings of the EU PVSEC 2020, p. 33 -37 | Abstract: | In this work, we present our progress on the multi-wire interconnection approach that we are developing, based on a contact sheet that integrates the interconnect wiring into the encapsulant. After a brief motivation and explanation of the concept, the latest results are indicated in terms of manufacturing of the contact sheets via 2 routes, and the potential in varying encapsulant formulation, wire diameter and solder coating thickness. After this, we discuss also our efforts in upscaling and automation of the technology, as well as the reliability testing and the application of the technology towards a BIPV environment. | Keywords: | Bifacial;Interconnection;Encapsulant/s;Integrated;Busbarless | Document URI: | http://hdl.handle.net/1942/34058 | ISBN: | 3936338736 | DOI: | 10.4229/EUPVSEC20202020-1AO.3.3 | Category: | C1 | Type: | Proceedings Paper |
Appears in Collections: | Research publications |
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1AO.3.3_paper.pdf Restricted Access | Published version | 707.98 kB | Adobe PDF | View/Open Request a copy |
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