Encapsulant-Integrated Interconnection of Bifacial Solar Cells for BIPV Applications: Latest Results in the Twill-BIPV Project

Abstract

In this work, we present our progress on the multi-wire interconnection approach that we are developing, based on a contact sheet that integrates the interconnect wiring into the encapsulant. After a brief motivation and explanation of the concept, the latest results are indicated in terms of manufacturing of the contact sheets via 2 routes, and the potential in varying encapsulant formulation, wire diameter and solder coating thickness. After this, we discuss also our efforts in upscaling and automation of the technology, as well as the reliability testing and the application of the technology towards a BIPV environment.