NIVELLE, Philippe

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NIVELLE, Philippe
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philippe.nivelle@uhasselt.be
 
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Publications

Results 1-20 of 21 (Search time: 0.005 seconds).

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Issue DateTitleContributor(s)TypeCat.
12024Investigation of static and dynamic mechanical loads on light-weight PV modules for offshore floating applicationsKYRANAKI, Nikoleta; NIVELLE, Philippe; BOUGUERRA, Sara; CASASOLA PAESA, Marta; DE JONG, Richard; Delbeke, Oscar; Spannan, Lars; VAN DER HEIDE, Arvid; KAAYA, Ismail; Moschner, Jens; MORLIER, Arnaud; DAENEN, MichaelJournal ContributionA1
22023In situ quantification of temperature and strain within photovoltaic modules through optical sensingNIVELLE, Philippe; MAES, Lowie; POORTMANS, Jef; DAENEN, MichaelJournal ContributionA1
32023Towards light-weight and mechanically durable photovoltaic modules for floating applicationsKYRANAKI, Nikoleta; NIVELLE, Philippe; CASASOLA PAESA, Marta; DE JONG, Richard; Spannan, Lars; VAN DER HEIDE, Arvid; KAAYA, Ismail; BOUGUERRA, Sara; Moschner, Jens; DAENEN, MichaelConference MaterialC2
42021Experimental Analysis of Laminated Bus Bars for Building-Integrated Photovoltaic ApplicationsRavyts, S; NIVELLE, Philippe; CAROLUS, Jorne; Sabariego, R; DAENEN, Michael; Driesen, J; Cappelle, JProceedings PaperC1
52021Introducing a Thermal-Based Method for Measuring Dynamic Thin Film Thickness in Real Time as a Tool for Sensing ApplicationsOUDEBROUCKX, Gilles; VANDENRYT, Thijs; NIVELLE, Philippe; BORMANS, Seppe; WAGNER, Patrick; THOELEN, RonaldJournal ContributionA1
62021Optical strain and temperature sensing within photovoltaic laminatesNIVELLE, Philippe; MAES, Lowie; POORTMANS, Jef; DAENEN, MichaelProceedings PaperC1
72021Stress and strain within photovoltaic modules using the finite element method: A critical reviewNIVELLE, Philippe; Tsanakas, JA; POORTMANS, Jef; DAENEN, MichaelJournal ContributionA1
82021Light weight interconnection weave for space PVBORGERS, Tom; Szlufcik, Jozef; Van Den Storme, Manuel; Van Den Storme, Guy; Brandt, Christian; Girolamo, Donato; Das, Shumit; Verdonck, Julo; NIVELLE, Philippe; GOVAERTS, Jonathan; Doumen, Geert; Vastmans, Luc; De Vrieze, Sander; Voroshazi, Eszter; POORTMANS, JefProceedings PaperC1
92020Thermo-Mechanical Stress Comparison of a GaN and SiC MOSFET for Photovoltaic ApplicationsVAN DE SANDE, Wieland; ALAVI, Omid; NIVELLE, Philippe; D'HAEN, Jan; DAENEN, MichaelJournal ContributionA1
102020The Sensitivity of an Electro-Thermal Photovoltaic DC–DC Converter Model to the Temperature Dependence of the Electrical Variables for Reliability AnalysesVAN DE SANDE, Wieland; Ravyts, Simon; ALAVI, Omid; NIVELLE, Philippe; Driesen, Johan; DAENEN, MichaelJournal ContributionA1
112020Encapsulant-Integrated Interconnection of Bifacial Solar Cells for BIPV Applications: Latest Results in the Twill-BIPV ProjectGOVAERTS, Jonathan; BORGERS, Tom; VAN DYCK, Rik; Andries, Nick; Meyers, Pieter; VAN DER HEIDE, Arvid; Vastmans, Luc; Moors, Reinoud; Doumen, Geert; NIVELLE, Philippe; DAENEN, Michael; Voroshazi, Eszter; Arnett, Chad; Labie, Riet; Van Den Storme, Manuel; Van Den Storme, Guy; Vandebroek, Steven; Schroyen, Peter; Smeers, Kris; Vavilkin, Tatjana; Dewallef, Stefan; Abgrall, Florent; Jousset, Dominique; POORTMANS, JefProceedings PaperC1
122020Layer Morphology and Ink Compatibility of Silver Nanoparticle Inkjet Inks for Near-Infrared SinteringREENAERS, Dieter; MARCHAL, Wouter; Biesmans, Ianto; NIVELLE, Philippe; D'HAEN, Jan; DEFERME, WimJournal ContributionA1
132019Interconnection 1, 2, 3, 4.0: Buildup towards a PV Technology Hero?BORGERS, Tom; GOVAERTS, Jonathan; VAN DYCK, Rik; El -Chami, Ibrahim; NIVELLE, Philippe; VAN DER HEIDE, Arvid; Doumen, Geert; Bervoets, Robert; Vastmans, Luc; Moors, Reinoud; Manganiello, Patrizio; Voroshazi, Eszter; Szlufcik, Jozef; POORTMANS, JefProceedings PaperC2
142018Progress in Encapsulant-Integrated Multi-Wire InterconnectionGOVAERTS, Jonathan; BORGERS, Tom; NIVELLE, Philippe; VAN DYCK, Rik; El-Chami, Ibrahim; Issa, Ibrahim; Hoogewijs, Tom; VAN DER HEIDE, Arvid; Voroshazi, Eszter; Szlufcik, Jozef; POORTMANS, JefProceedings PaperC2
152018Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modulesNIVELLE, Philippe; BORGERS, Tom; Voroshazi, Eszter; POORTMANS, Jef; D'HAEN, Jan; DE CEUNINCK, Ward; DAENEN, MichaelProceedings PaperC1
162018Multi-wire interconnection: The impact of the lamination process and the encapsulant properties on the solder joint formationVAN DYCK, Rik; BORGERS, Tom; GOVAERTS, Jonathan; NIVELLE, Philippe; VAN DER HEIDE, Arvid; De Jonge, S.; Voroshazi, Eszter; Szlufcik, Jozef; Van Vuure, Aart Willem; POORTMANS, JefProceedings PaperC1
172018Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modulesNIVELLE, Philippe; BORGERS, Tom; Voroshazi, Eszter; POORTMANS, Jef; D'HAEN, Jan; DE CEUNINCK, Ward; DAENEN, MichaelConference MaterialC2
182017Mechanical Sensitivity analysis of a sub cell using wire interconnectionNIVELLE, Philippe; DAENEN, Michael; BORGERS, Tom; GOVAERTS, Jonathan; Vörösházi, E.; POORTMANS, JefConference MaterialC2
192017Combined Interconnection and Lamination of Bifacial Busbarless Cells through Woven WiringBORGERS, Tom; GOVAERTS, Jonathan; D'HAEN, Jan; NIVELLE, Philippe; Voroshazi, Eszter; Szlufcik, Jozef; POORTMANS, Jef; DAENEN, MichaelProceedings PaperC1
202017Thermo-mechanical finite element simulation of a sub-cell utilising wire interconnectionNIVELLE, Philippe; DAENEN, Michael; Vörösházi E.; D'HAEN, Jan; POORTMANS, JefConference MaterialC2
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