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http://hdl.handle.net/1942/26698| Title: | Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modules | Authors: | NIVELLE, Philippe BORGERS, Tom Voroshazi, Eszter POORTMANS, Jef D'HAEN, Jan DE CEUNINCK, Ward DAENEN, Michael |
Issue Date: | 2018 | Source: | 2018 IEEE International Reliability Physics Symposium (IRPS), Burlingame - California, USA, 11-15/03/2018 | Abstract: | In this work, new insights on adhesion of encapsulants to various photovoltaic related surfaces are gained. The effect of flux on the adhesion strength of encapsulant is also studied. A relation between surface roughness and adhesion strengh is exposed. | Keywords: | encapsulant; flux; interface; photovoltaic; modules; PV; adhesion | Document URI: | http://hdl.handle.net/1942/26698 | Category: | C2 | Type: | Conference Material |
| Appears in Collections: | Research publications |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| IRPS_Oral_presentation_PhilippeNivelleV4.pptx Restricted Access | Supplementary material - Presentation | 20.16 MB | Microsoft Powerpoint | View/Open Request a copy |
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