Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modules

Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/26698

Title:	Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modules
Authors:	NIVELLE, Philippe BORGERS, Tom Voroshazi, Eszter POORTMANS, Jef D'HAEN, Jan DE CEUNINCK, Ward DAENEN, Michael
Issue Date:	2018
Source:	2018 IEEE International Reliability Physics Symposium (IRPS), Burlingame - California, USA, 11-15/03/2018
Abstract:	In this work, new insights on adhesion of encapsulants to various photovoltaic related surfaces are gained. The effect of flux on the adhesion strength of encapsulant is also studied. A relation between surface roughness and adhesion strengh is exposed.
Keywords:	encapsulant; flux; interface; photovoltaic; modules; PV; adhesion
Document URI:	http://hdl.handle.net/1942/26698
Category:	C2
Type:	Conference Material
Appears in Collections:	Research publications

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