Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/26698
Title: Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modules
Authors: NIVELLE, Philippe 
BORGERS, Tom 
Voroshazi, Eszter
POORTMANS, Jef 
D'HAEN, Jan 
DE CEUNINCK, Ward 
DAENEN, Michael 
Issue Date: 2018
Source: 2018 IEEE International Reliability Physics Symposium (IRPS), Burlingame - California, USA, 11-15/03/2018
Abstract: In this work, new insights on adhesion of encapsulants to various photovoltaic related surfaces are gained. The effect of flux on the adhesion strength of encapsulant is also studied. A relation between surface roughness and adhesion strengh is exposed.
Keywords: encapsulant; flux; interface; photovoltaic; modules; PV; adhesion
Document URI: http://hdl.handle.net/1942/26698
Category: C2
Type: Conference Material
Appears in Collections:Research publications

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