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Title: | Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modules | Authors: | NIVELLE, Philippe BORGERS, Tom Voroshazi, Eszter POORTMANS, Jef D'HAEN, Jan DE CEUNINCK, Ward DAENEN, Michael |
Issue Date: | 2018 | Publisher: | IEEE | Source: | 2018 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), IEEE, | Series/Report: | International Reliability Physics Symposium | Abstract: | Encapsulants are known to have a large impact on the reliability of PV modules. Use of new materials such as low temperature solder can have an impact on how the encapsulant behaves in a module throughout its lifetime. A novel test methodology is used in this work to measure the adhesion strength between the encapsulant and its interfaces. The methodology is applied to both plated as screen printed metallization, low temperature SnBiAg solder and thermally evaporated Ag. The first steps in determining the underlying physical phenomena are studied experimentally for these interfaces as they can provide input for reliability models. | Notes: | [Nivelle, Philippe; D'Haen, Jan; Daenen, Michael] Hassell Univ, Martelarenlaan 42, B-3500 Hasselt, Belgium. [Nivelle, Philippe; Borgers, Tom; Voroshazi, Eszter; Poortmans, Jef; De Ceuninck, Ward; Daenen, Michael] IMEC, Kapeldreef 75, B-3001 Heverlee, Belgium. | Keywords: | Adhesion;Encapsulant;Reliability;Peel test;Photovoltaic modules (PV) | Document URI: | http://hdl.handle.net/1942/28765 | ISBN: | 97815386-54798 | DOI: | 10.1109/IRPS.2018.8353630 | ISI #: | 000468959600091 | Rights: | 2018 IEEE | Category: | C1 | Type: | Proceedings Paper |
Appears in Collections: | Research publications |
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Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modules.pdf Restricted Access | Published version | 3.1 MB | Adobe PDF | View/Open Request a copy |
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