NIVELLE, Philippe

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NIVELLE, Philippe
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philippe.nivelle@uhasselt.be
 
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Publications

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Author:  GOVAERTS, Jonathan

Results 1-8 of 8 (Search time: 0.003 seconds).

Issue DateTitleContributor(s)TypeCat.
12021LIGHT WEIGHT INTERCONNECTION WEAVE FOR SPACE PVBORGERS, Tom; Szlufcik, Jozef; Van Den Storme, Manuel; Van Den Storme, Guy; Brandt, Christian; Girolamo, Donato; Das, Shumit; Verdonck, Julo; NIVELLE, Philippe; GOVAERTS, Jonathan; Doumen, Geert; Vastmans, Luc; De Vrieze, Sander; Voroshazi, Eszter; POORTMANS, JefProceedings PaperC1
22020Encapsulant-Integrated Interconnection of Bifacial Solar Cells for BIPV Applications: Latest Results in the Twill-BIPV ProjectGOVAERTS, Jonathan; BORGERS, Tom; VAN DYCK, Rik; Andries, Nick; Meyers, Pieter; VAN DER HEIDE, Arvid; Vastmans, Luc; Moors, Reinoud; Doumen, Geert; NIVELLE, Philippe; DAENEN, Michael; Voroshazi, Eszter; Arnett, Chad; Labie, Riet; Van Den Storme, Manuel; Van Den Storme, Guy; Vandebroek, Steven; Schroyen, Peter; Smeers, Kris; Vavilkin, Tatjana; Dewallef, Stefan; Abgrall, Florent; Jousset, Dominique; POORTMANS, JefProceedings PaperC1
32019Interconnection 1, 2, 3, 4.0: Buildup towards a PV Technology Hero?BORGERS, Tom; GOVAERTS, Jonathan; VAN DYCK, Rik; El -Chami, Ibrahim; NIVELLE, Philippe; VAN DER HEIDE, Arvid; Doumen, Geert; Bervoets, Robert; Vastmans, Luc; Moors, Reinoud; Manganiello, Patrizio; Voroshazi, Eszter; Szlufcik, Jozef; POORTMANS, JefProceedings PaperC2
42018Multi-wire interconnection: The impact of the lamination process and the encapsulant properties on the solder joint formationVAN DYCK, Rik; BORGERS, Tom; GOVAERTS, Jonathan; NIVELLE, Philippe; VAN DER HEIDE, Arvid; De Jonge, S.; Voroshazi, Eszter; Szlufcik, Jozef; Van Vuure, Aart Willem; POORTMANS, JefProceedings PaperC1
52018Progress in Encapsulant-Integrated Multi-Wire InterconnectionGOVAERTS, Jonathan; BORGERS, Tom; NIVELLE, Philippe; VAN DYCK, Rik; El-Chami, Ibrahim; Issa, Ibrahim; Hoogewijs, Tom; VAN DER HEIDE, Arvid; Voroshazi, Eszter; Szlufcik, Jozef; POORTMANS, JefProceedings PaperC2
62017Mechanical Sensitivity analysis of a sub cell using wire interconnectionNIVELLE, Philippe; DAENEN, Michael; BORGERS, Tom; GOVAERTS, Jonathan; Vörösházi, E.; POORTMANS, JefConference MaterialC2
72017Combined Interconnection and Lamination of Bifacial Busbarless Cells through Woven WiringBORGERS, Tom; GOVAERTS, Jonathan; D'HAEN, Jan; NIVELLE, Philippe; Voroshazi, Eszter; Szlufcik, Jozef; POORTMANS, Jef; DAENEN, MichaelProceedings PaperC1
82017Expansion of the mechanical sub cell model with interface parameters provided by mechanical testingNIVELLE, Philippe; BORGERS, Tom; GOVAERTS, Jonathan; VAN DER HEIDE, Arvid; DAENEN, Michael; Singh, S.; Pedreira, O; DESTA, Derese; Horváth T., I; Vörösházi, E.; POORTMANS, JefConference MaterialC2