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http://hdl.handle.net/1942/15120
Title: | An environment friendly wet strip process for 193 nm lithography patterning in BEOL applications | Authors: | Vereecke, G. KESTERS, Els Le, Q. T. CLAES, Monica Lux, M. Struyf, H. CARLEER, Robert ADRIAENSENS, Peter |
Issue Date: | 2013 | Publisher: | ELSEVIER SCIENCE BV | Source: | MICROELECTRONIC ENGINEERING, 105, p. 119-123 | Abstract: | In semiconductor Back-End-of-Line (BEOL) processing, wet organic strippers have gained a renewed interest for removal of etched photoresist (PR) layers to replace plasma strip, which degrades porous low-k dielectrics. In this study we show how the characterization of 193-nm PR degradation by etch plasmas led to the development of an environment friendly wet strip using aqueous ozone solutions. Characterization of post-etch PR films have shown that degradation was similar to that of poly(methyl acrylate/methacrylate) (PMA/PMMA) by UV light, with formation of single and conjugated C=C bonds in PR chains. However little removal was obtained with O-3/H2O strips without an organic solvent rinse, indicating reactions fragments were too long for a complete dissolution in water. In turn known effects of UV on PMA/PMMA were used to develop an optimized UV pre-treatment enabling a fully aqueous O-3 strip. This process was shown to efficiently remove PR in a dual damascene application. Also we shortly discuss the impact of materials selection on process efficiency, improvement in low-k compatibility and transfer to a production environment. (C) 2012 Elsevier B.V. All rights reserved. | Notes: | [Vereecke, G.; Kesters, E.; Le, Q. T.; Claes, M.; Lux, M.; Struyf, H.] IMEC, B-3001 Louvain, Belgium. [Carleer, R.; Adriaensens, P.] U Hasselt, IMO Div Chem, B-3590 Diepenbeek, Belgium. | Keywords: | Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Optics; Physics, Applied;Photoresist;Wet strip;UV;Ozone;ES&H | Document URI: | http://hdl.handle.net/1942/15120 | ISSN: | 0167-9317 | e-ISSN: | 1873-5568 | DOI: | 10.1016/j.mee.2012.10.018 | ISI #: | 000316529600023 | Rights: | 2012 Elsevier B.V. All rights reserved | Category: | A1 | Type: | Journal Contribution | Validations: | ecoom 2014 |
Appears in Collections: | Research publications |
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