Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/3842
Title: THE INFLUENCE OF CURRENT STRESS ON THE AGING OF AU-ALL-PERCENT-SI(1-PERCENT-CU) BALL-BOND CONTACTS STUDIED BY SEM AND EDX
Authors: D'OLIESLAEGER, Marc 
DE SCHEPPER, Luc 
DE CEUNINCK, Ward 
STALS, Lambert 
Issue Date: 1992
Publisher: ELSEVIER SCIENCE BV
Source: MICROELECTRONIC ENGINEERING, 19(1-4). p. 579-584
Abstract: SEM/EDX investigations on top-view and cross-sectional ball-bond samples show that an applied current stress influences the ageing characteristics of Al-Au ball-bond contacts. It is found that the direction of the applied current stress is affecting the formation of the Al-Au intermetallics. Two types of metallization layers are investigated: Al1%Si and Al1%Si1%Cu.
Notes: DOLIESLAEGER, M, LIMBURGS UNIV CENTRUM,INST MAT RES,DIV MAT PHYS,B-3590 DIEPENBEEK,BELGIUM.
Document URI: http://hdl.handle.net/1942/3842
DOI: 10.1016/0167-9317(92)90501-H
ISI #: A1992KA73100121
Type: Journal Contribution
Appears in Collections:Research publications

Show full item record

SCOPUSTM   
Citations

2
checked on Sep 3, 2020

WEB OF SCIENCETM
Citations

2
checked on May 29, 2022

Page view(s)

10
checked on May 28, 2022

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.