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http://hdl.handle.net/1942/3842
Full metadata record
DC Field | Value | Language |
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dc.contributor.author | D'OLIESLAEGER, Marc | - |
dc.contributor.author | DE SCHEPPER, Luc | - |
dc.contributor.author | DE CEUNINCK, Ward | - |
dc.contributor.author | STALS, Lambert | - |
dc.date.accessioned | 2007-11-29T14:29:49Z | - |
dc.date.available | 2007-11-29T14:29:49Z | - |
dc.date.issued | 1992 | - |
dc.identifier.citation | MICROELECTRONIC ENGINEERING, 19(1-4). p. 579-584 | - |
dc.identifier.issn | 0167-9317 | - |
dc.identifier.uri | http://hdl.handle.net/1942/3842 | - |
dc.description.abstract | SEM/EDX investigations on top-view and cross-sectional ball-bond samples show that an applied current stress influences the ageing characteristics of Al-Au ball-bond contacts. It is found that the direction of the applied current stress is affecting the formation of the Al-Au intermetallics. Two types of metallization layers are investigated: Al1%Si and Al1%Si1%Cu. | - |
dc.language.iso | en | - |
dc.publisher | ELSEVIER SCIENCE BV | - |
dc.title | The influence of current stress on the aging of Au-all-percent-Si(1-percent-Cu) ball-bond contacts studied by SEM and EDX | - |
dc.type | Journal Contribution | - |
dc.identifier.epage | 584 | - |
dc.identifier.issue | 1-4 | - |
dc.identifier.spage | 579 | - |
dc.identifier.volume | 19 | - |
local.format.pages | 6 | - |
dc.description.notes | DOLIESLAEGER, M, LIMBURGS UNIV CENTRUM,INST MAT RES,DIV MAT PHYS,B-3590 DIEPENBEEK,BELGIUM. | - |
local.type.refereed | Refereed | - |
local.type.specified | Article | - |
dc.bibliographicCitation.oldjcat | A1 | - |
dc.identifier.doi | 10.1016/0167-9317(92)90501-H | - |
dc.identifier.isi | A1992KA73100121 | - |
item.fulltext | No Fulltext | - |
item.contributor | D'OLIESLAEGER, Marc | - |
item.contributor | DE SCHEPPER, Luc | - |
item.contributor | DE CEUNINCK, Ward | - |
item.contributor | STALS, Lambert | - |
item.fullcitation | D'OLIESLAEGER, Marc; DE SCHEPPER, Luc; DE CEUNINCK, Ward & STALS, Lambert (1992) The influence of current stress on the aging of Au-all-percent-Si(1-percent-Cu) ball-bond contacts studied by SEM and EDX. In: MICROELECTRONIC ENGINEERING, 19(1-4). p. 579-584. | - |
item.accessRights | Closed Access | - |
Appears in Collections: | Research publications |
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