Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/3842
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dc.contributor.authorD'OLIESLAEGER, Marc-
dc.contributor.authorDE SCHEPPER, Luc-
dc.contributor.authorDE CEUNINCK, Ward-
dc.contributor.authorSTALS, Lambert-
dc.date.accessioned2007-11-29T14:29:49Z-
dc.date.available2007-11-29T14:29:49Z-
dc.date.issued1992-
dc.identifier.citationMICROELECTRONIC ENGINEERING, 19(1-4). p. 579-584-
dc.identifier.issn0167-9317-
dc.identifier.urihttp://hdl.handle.net/1942/3842-
dc.description.abstractSEM/EDX investigations on top-view and cross-sectional ball-bond samples show that an applied current stress influences the ageing characteristics of Al-Au ball-bond contacts. It is found that the direction of the applied current stress is affecting the formation of the Al-Au intermetallics. Two types of metallization layers are investigated: Al1%Si and Al1%Si1%Cu.-
dc.language.isoen-
dc.publisherELSEVIER SCIENCE BV-
dc.titleTHE INFLUENCE OF CURRENT STRESS ON THE AGING OF AU-ALL-PERCENT-SI(1-PERCENT-CU) BALL-BOND CONTACTS STUDIED BY SEM AND EDX-
dc.typeJournal Contribution-
dc.identifier.epage584-
dc.identifier.issue1-4-
dc.identifier.spage579-
dc.identifier.volume19-
local.format.pages6-
dc.description.notesDOLIESLAEGER, M, LIMBURGS UNIV CENTRUM,INST MAT RES,DIV MAT PHYS,B-3590 DIEPENBEEK,BELGIUM.-
local.type.refereedRefereed-
local.type.specifiedArticle-
dc.bibliographicCitation.oldjcatA1-
dc.identifier.doi10.1016/0167-9317(92)90501-H-
dc.identifier.isiA1992KA73100121-
item.accessRightsClosed Access-
item.contributorD'OLIESLAEGER, Marc-
item.contributorDE SCHEPPER, Luc-
item.contributorDE CEUNINCK, Ward-
item.contributorSTALS, Lambert-
item.fulltextNo Fulltext-
item.fullcitationD'OLIESLAEGER, Marc; DE SCHEPPER, Luc; DE CEUNINCK, Ward & STALS, Lambert (1992) THE INFLUENCE OF CURRENT STRESS ON THE AGING OF AU-ALL-PERCENT-SI(1-PERCENT-CU) BALL-BOND CONTACTS STUDIED BY SEM AND EDX. In: MICROELECTRONIC ENGINEERING, 19(1-4). p. 579-584.-
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