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http://hdl.handle.net/1942/3842| Title: | THE INFLUENCE OF CURRENT STRESS ON THE AGING OF AU-ALL-PERCENT-SI(1-PERCENT-CU) BALL-BOND CONTACTS STUDIED BY SEM AND EDX | Authors: | D'OLIESLAEGER, Marc DE SCHEPPER, Luc DE CEUNINCK, Ward STALS, Lambert |
Issue Date: | 1992 | Publisher: | ELSEVIER SCIENCE BV | Source: | MICROELECTRONIC ENGINEERING, 19(1-4). p. 579-584 | Abstract: | SEM/EDX investigations on top-view and cross-sectional ball-bond samples show that an applied current stress influences the ageing characteristics of Al-Au ball-bond contacts. It is found that the direction of the applied current stress is affecting the formation of the Al-Au intermetallics. Two types of metallization layers are investigated: Al1%Si and Al1%Si1%Cu. | Notes: | DOLIESLAEGER, M, LIMBURGS UNIV CENTRUM,INST MAT RES,DIV MAT PHYS,B-3590 DIEPENBEEK,BELGIUM. | Document URI: | http://hdl.handle.net/1942/3842 | DOI: | 10.1016/0167-9317(92)90501-H | ISI #: | A1992KA73100121 | Type: | Journal Contribution |
| Appears in Collections: | Research publications |
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