The influence of current stress on the aging of Au-all-percent-Si(1-percent-Cu) ball-bond contacts studied by SEM and EDX

Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/3842

Title:	The influence of current stress on the aging of Au-all-percent-Si(1-percent-Cu) ball-bond contacts studied by SEM and EDX
Authors:	D'OLIESLAEGER, Marc DE SCHEPPER, Luc DE CEUNINCK, Ward STALS, Lambert
Issue Date:	1992
Publisher:	ELSEVIER SCIENCE BV
Source:	MICROELECTRONIC ENGINEERING, 19(1-4). p. 579-584
Abstract:	SEM/EDX investigations on top-view and cross-sectional ball-bond samples show that an applied current stress influences the ageing characteristics of Al-Au ball-bond contacts. It is found that the direction of the applied current stress is affecting the formation of the Al-Au intermetallics. Two types of metallization layers are investigated: Al1%Si and Al1%Si1%Cu.
Notes:	DOLIESLAEGER, M, LIMBURGS UNIV CENTRUM,INST MAT RES,DIV MAT PHYS,B-3590 DIEPENBEEK,BELGIUM.
Document URI:	http://hdl.handle.net/1942/3842
DOI:	10.1016/0167-9317(92)90501-H
ISI #:	A1992KA73100121
Type:	Journal Contribution
Appears in Collections:	Research publications

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