Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/6236
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dc.contributor.authorGregoris, G.-
dc.contributor.authorBouton, F.-
dc.contributor.authorde Keukeleire, C.-
dc.contributor.authorSiliprandi, P.-
dc.contributor.authorBaio, F.-
dc.contributor.authorDE SCHEPPER, Luc-
dc.contributor.authorDE CEUNINCK, Ward-
dc.contributor.authorTielemans, L.-
dc.contributor.authorAhrens, T.-
dc.contributor.authorKrumm, M.-
dc.date.accessioned2007-12-20T16:06:14Z-
dc.date.available2007-12-20T16:06:14Z-
dc.date.issued1995-
dc.identifier.citationProceedings 7th International Conference on Quality in Electronic Components, Failure Prevention, Detection and Analysis (ESREF) '95. p. 155-160.-
dc.identifier.urihttp://hdl.handle.net/1942/6236-
dc.language.isoen-
dc.titleEvaluation on a two days time scale of high reliability electronic assemblies by in-situ electrical and optomechanical tests techniques-
dc.typeProceedings Paper-
local.bibliographicCitation.conferencedate1995-
local.bibliographicCitation.conferencenameInternational Conference on Quality in Electronic Components, Failure Prevention, Detection and Analysis (ESREF) '95-
dc.bibliographicCitation.conferencenr7-
local.bibliographicCitation.conferenceplaceBordeaux-
dc.identifier.epage160-
dc.identifier.spage155-
local.type.specifiedProceedings Paper-
dc.bibliographicCitation.oldjcat-
local.bibliographicCitation.btitleProceedings 7th International Conference on Quality in Electronic Components, Failure Prevention, Detection and Analysis (ESREF) '95-
item.contributorGregoris, G.-
item.contributorBouton, F.-
item.contributorde Keukeleire, C.-
item.contributorSiliprandi, P.-
item.contributorBaio, F.-
item.contributorDE SCHEPPER, Luc-
item.contributorDE CEUNINCK, Ward-
item.contributorTielemans, L.-
item.contributorAhrens, T.-
item.contributorKrumm, M.-
item.accessRightsClosed Access-
item.fullcitationGregoris, G.; Bouton, F.; de Keukeleire, C.; Siliprandi, P.; Baio, F.; DE SCHEPPER, Luc; DE CEUNINCK, Ward; Tielemans, L.; Ahrens, T. & Krumm, M. (1995) Evaluation on a two days time scale of high reliability electronic assemblies by in-situ electrical and optomechanical tests techniques. In: Proceedings 7th International Conference on Quality in Electronic Components, Failure Prevention, Detection and Analysis (ESREF) '95. p. 155-160..-
item.fulltextNo Fulltext-
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