Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/8184
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dc.contributor.authorVANSTREELS, Kris-
dc.contributor.authorBrongersma, SH-
dc.contributor.authorDemuynck, S-
dc.contributor.authorCarbonell, L-
dc.contributor.authorD'HAEN, Jan-
dc.contributor.authorDE CEUNINCK, Ward-
dc.contributor.authorD'OLIESLAEGER, Marc-
dc.contributor.authorMaex, K-
dc.date.accessioned2008-04-08T10:10:08Z-
dc.date.available2008-04-08T10:10:08Z-
dc.date.issued2006-
dc.identifier.citationBrongersma, SH Taylor, TC Tsujimura, M Masu, K (Ed.) ADVANCED METALLIZATION CONFERENCE 2005 (AMC 2005). p. 615-621.-
dc.identifier.isbn1-55899-865-9-
dc.identifier.urihttp://hdl.handle.net/1942/8184-
dc.description.abstractSuper secondary grain growth is initiated in electroplated copper films deposited on thin seed layers on a alpha-Ta barrier layer. Both growth dynamics and self annealing time strongly depend on the copper seed layer bias conditions, barrier bias conditions, barrier composition and the ECD/PVD thickness ratio. This is consistent with an orientation dependent driving force for super grains in an ECD/PVD bi-layer system. The barrier layer seems to play a critical role in the initiation of abnormal SSGG, while strain energy minimization seems to be an important driving force.-
dc.language.isoen-
dc.publisherMATERIALS RESEARCH SOCIETY-
dc.titleSuper secondary grain growth initiation in electroplated copper-
dc.typeProceedings Paper-
local.bibliographicCitation.authorsBrongersma, SH Taylor, TC Tsujimura, M Masu, K-
local.bibliographicCitation.conferencedateSEP 27-29, 2005-
local.bibliographicCitation.conferencename22nd Annual Advanced Metallization Conference (AMC)-
local.bibliographicCitation.conferenceplaceColorado Springs, CO-
dc.identifier.epage621-
dc.identifier.spage615-
local.format.pages7-
local.bibliographicCitation.jcatC1-
dc.description.notesHasselt Univ, Inst Mat Res, Diepenbeek, B-3590 Belgium.Vanstreels, K, Hasselt Univ, Inst Mat Res, Wetenschapspk 1, Diepenbeek, B-3590 Belgium.-
local.type.refereedRefereed-
local.type.specifiedArticle-
dc.bibliographicCitation.oldjcatC1-
dc.identifier.isi000236430900087-
local.bibliographicCitation.btitleADVANCED METALLIZATION CONFERENCE 2005 (AMC 2005)-
item.fullcitationVANSTREELS, Kris; Brongersma, SH; Demuynck, S; Carbonell, L; D'HAEN, Jan; DE CEUNINCK, Ward; D'OLIESLAEGER, Marc & Maex, K (2006) Super secondary grain growth initiation in electroplated copper. In: Brongersma, SH Taylor, TC Tsujimura, M Masu, K (Ed.) ADVANCED METALLIZATION CONFERENCE 2005 (AMC 2005). p. 615-621..-
item.fulltextNo Fulltext-
item.accessRightsClosed Access-
item.validationecoom 2007-
item.contributorVANSTREELS, Kris-
item.contributorCarbonell, L-
item.contributorDemuynck, S-
item.contributorDE CEUNINCK, Ward-
item.contributorMaex, K-
item.contributorD'OLIESLAEGER, Marc-
item.contributorBrongersma, SH-
item.contributorD'HAEN, Jan-
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