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http://hdl.handle.net/1942/8184
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DC Field | Value | Language |
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dc.contributor.author | VANSTREELS, Kris | - |
dc.contributor.author | Brongersma, SH | - |
dc.contributor.author | Demuynck, S | - |
dc.contributor.author | Carbonell, L | - |
dc.contributor.author | D'HAEN, Jan | - |
dc.contributor.author | DE CEUNINCK, Ward | - |
dc.contributor.author | D'OLIESLAEGER, Marc | - |
dc.contributor.author | Maex, K | - |
dc.date.accessioned | 2008-04-08T10:10:08Z | - |
dc.date.available | 2008-04-08T10:10:08Z | - |
dc.date.issued | 2006 | - |
dc.identifier.citation | Brongersma, SH Taylor, TC Tsujimura, M Masu, K (Ed.) ADVANCED METALLIZATION CONFERENCE 2005 (AMC 2005). p. 615-621. | - |
dc.identifier.isbn | 1-55899-865-9 | - |
dc.identifier.uri | http://hdl.handle.net/1942/8184 | - |
dc.description.abstract | Super secondary grain growth is initiated in electroplated copper films deposited on thin seed layers on a alpha-Ta barrier layer. Both growth dynamics and self annealing time strongly depend on the copper seed layer bias conditions, barrier bias conditions, barrier composition and the ECD/PVD thickness ratio. This is consistent with an orientation dependent driving force for super grains in an ECD/PVD bi-layer system. The barrier layer seems to play a critical role in the initiation of abnormal SSGG, while strain energy minimization seems to be an important driving force. | - |
dc.language.iso | en | - |
dc.publisher | MATERIALS RESEARCH SOCIETY | - |
dc.title | Super secondary grain growth initiation in electroplated copper | - |
dc.type | Proceedings Paper | - |
local.bibliographicCitation.authors | Brongersma, SH Taylor, TC Tsujimura, M Masu, K | - |
local.bibliographicCitation.conferencedate | SEP 27-29, 2005 | - |
local.bibliographicCitation.conferencename | 22nd Annual Advanced Metallization Conference (AMC) | - |
local.bibliographicCitation.conferenceplace | Colorado Springs, CO | - |
dc.identifier.epage | 621 | - |
dc.identifier.spage | 615 | - |
local.format.pages | 7 | - |
local.bibliographicCitation.jcat | C1 | - |
dc.description.notes | Hasselt Univ, Inst Mat Res, Diepenbeek, B-3590 Belgium.Vanstreels, K, Hasselt Univ, Inst Mat Res, Wetenschapspk 1, Diepenbeek, B-3590 Belgium. | - |
local.type.refereed | Refereed | - |
local.type.specified | Article | - |
dc.bibliographicCitation.oldjcat | C1 | - |
dc.identifier.isi | 000236430900087 | - |
local.bibliographicCitation.btitle | ADVANCED METALLIZATION CONFERENCE 2005 (AMC 2005) | - |
item.accessRights | Closed Access | - |
item.fullcitation | VANSTREELS, Kris; Brongersma, SH; Demuynck, S; Carbonell, L; D'HAEN, Jan; DE CEUNINCK, Ward; D'OLIESLAEGER, Marc & Maex, K (2006) Super secondary grain growth initiation in electroplated copper. In: Brongersma, SH Taylor, TC Tsujimura, M Masu, K (Ed.) ADVANCED METALLIZATION CONFERENCE 2005 (AMC 2005). p. 615-621.. | - |
item.fulltext | No Fulltext | - |
item.contributor | VANSTREELS, Kris | - |
item.contributor | Brongersma, SH | - |
item.contributor | Demuynck, S | - |
item.contributor | Carbonell, L | - |
item.contributor | D'HAEN, Jan | - |
item.contributor | DE CEUNINCK, Ward | - |
item.contributor | D'OLIESLAEGER, Marc | - |
item.contributor | Maex, K | - |
item.validation | ecoom 2007 | - |
Appears in Collections: | Research publications |
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