Please use this identifier to cite or link to this item:
http://hdl.handle.net/1942/8184
Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | VANSTREELS, Kris | - |
dc.contributor.author | Brongersma, SH | - |
dc.contributor.author | Demuynck, S | - |
dc.contributor.author | Carbonell, L | - |
dc.contributor.author | D'HAEN, Jan | - |
dc.contributor.author | DE CEUNINCK, Ward | - |
dc.contributor.author | D'OLIESLAEGER, Marc | - |
dc.contributor.author | Maex, K | - |
dc.date.accessioned | 2008-04-08T10:10:08Z | - |
dc.date.available | 2008-04-08T10:10:08Z | - |
dc.date.issued | 2006 | - |
dc.identifier.citation | Brongersma, SH Taylor, TC Tsujimura, M Masu, K (Ed.) ADVANCED METALLIZATION CONFERENCE 2005 (AMC 2005). p. 615-621. | - |
dc.identifier.isbn | 1-55899-865-9 | - |
dc.identifier.uri | http://hdl.handle.net/1942/8184 | - |
dc.description.abstract | Super secondary grain growth is initiated in electroplated copper films deposited on thin seed layers on a alpha-Ta barrier layer. Both growth dynamics and self annealing time strongly depend on the copper seed layer bias conditions, barrier bias conditions, barrier composition and the ECD/PVD thickness ratio. This is consistent with an orientation dependent driving force for super grains in an ECD/PVD bi-layer system. The barrier layer seems to play a critical role in the initiation of abnormal SSGG, while strain energy minimization seems to be an important driving force. | - |
dc.language.iso | en | - |
dc.publisher | MATERIALS RESEARCH SOCIETY | - |
dc.title | Super secondary grain growth initiation in electroplated copper | - |
dc.type | Proceedings Paper | - |
local.bibliographicCitation.authors | Brongersma, SH Taylor, TC Tsujimura, M Masu, K | - |
local.bibliographicCitation.conferencedate | SEP 27-29, 2005 | - |
local.bibliographicCitation.conferencename | 22nd Annual Advanced Metallization Conference (AMC) | - |
local.bibliographicCitation.conferenceplace | Colorado Springs, CO | - |
dc.identifier.epage | 621 | - |
dc.identifier.spage | 615 | - |
local.format.pages | 7 | - |
local.bibliographicCitation.jcat | C1 | - |
dc.description.notes | Hasselt Univ, Inst Mat Res, Diepenbeek, B-3590 Belgium.Vanstreels, K, Hasselt Univ, Inst Mat Res, Wetenschapspk 1, Diepenbeek, B-3590 Belgium. | - |
local.type.refereed | Refereed | - |
local.type.specified | Article | - |
dc.bibliographicCitation.oldjcat | C1 | - |
dc.identifier.isi | 000236430900087 | - |
local.bibliographicCitation.btitle | ADVANCED METALLIZATION CONFERENCE 2005 (AMC 2005) | - |
item.fullcitation | VANSTREELS, Kris; Brongersma, SH; Demuynck, S; Carbonell, L; D'HAEN, Jan; DE CEUNINCK, Ward; D'OLIESLAEGER, Marc & Maex, K (2006) Super secondary grain growth initiation in electroplated copper. In: Brongersma, SH Taylor, TC Tsujimura, M Masu, K (Ed.) ADVANCED METALLIZATION CONFERENCE 2005 (AMC 2005). p. 615-621.. | - |
item.contributor | VANSTREELS, Kris | - |
item.contributor | Brongersma, SH | - |
item.contributor | Demuynck, S | - |
item.contributor | Carbonell, L | - |
item.contributor | D'HAEN, Jan | - |
item.contributor | DE CEUNINCK, Ward | - |
item.contributor | D'OLIESLAEGER, Marc | - |
item.contributor | Maex, K | - |
item.validation | ecoom 2007 | - |
item.accessRights | Closed Access | - |
item.fulltext | No Fulltext | - |
Appears in Collections: | Research publications |
WEB OF SCIENCETM
Citations
2
checked on Sep 21, 2024
Page view(s)
48
checked on Nov 7, 2023
Google ScholarTM
Check
Altmetric
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.