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http://hdl.handle.net/1942/8184
Title: | Super secondary grain growth initiation in electroplated copper | Authors: | VANSTREELS, Kris Brongersma, SH Demuynck, S Carbonell, L D'HAEN, Jan DE CEUNINCK, Ward D'OLIESLAEGER, Marc Maex, K |
Issue Date: | 2006 | Publisher: | MATERIALS RESEARCH SOCIETY | Source: | Brongersma, SH Taylor, TC Tsujimura, M Masu, K (Ed.) ADVANCED METALLIZATION CONFERENCE 2005 (AMC 2005). p. 615-621. | Abstract: | Super secondary grain growth is initiated in electroplated copper films deposited on thin seed layers on a alpha-Ta barrier layer. Both growth dynamics and self annealing time strongly depend on the copper seed layer bias conditions, barrier bias conditions, barrier composition and the ECD/PVD thickness ratio. This is consistent with an orientation dependent driving force for super grains in an ECD/PVD bi-layer system. The barrier layer seems to play a critical role in the initiation of abnormal SSGG, while strain energy minimization seems to be an important driving force. | Notes: | Hasselt Univ, Inst Mat Res, Diepenbeek, B-3590 Belgium.Vanstreels, K, Hasselt Univ, Inst Mat Res, Wetenschapspk 1, Diepenbeek, B-3590 Belgium. | Document URI: | http://hdl.handle.net/1942/8184 | ISBN: | 1-55899-865-9 | ISI #: | 000236430900087 | Category: | C1 | Type: | Proceedings Paper | Validations: | ecoom 2007 |
Appears in Collections: | Research publications |
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