VANSTREELS, Kris

Full Name
VANSTREELS, Kris
Email
kris.vanstreels@uhasselt.be
 
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Publications

Results 1-13 of 13 (Search time: 0.011 seconds).

Issue DateTitleAuthor(s)TypeCat.
12008Increasing the mean grain size in copper films and featuresVANSTREELS, Kris ; Brongersma, S.H.; Tokei, Zs.; Carbonell, L; DE CEUNINCK, Ward ; D'HAEN, Jan ; D'OLIESLAEGER, Marc Journal ContributionA1
22007Electrical performance, reliability and microstructure of sub-45 nm copper damascene lines fabricated with TEOS backfillLeaming-Sphabmixay, K.; VAN OLMEN, Jan ; Moon, K. J.; VANSTREELS, Kris ; D'HAEN, Jan ; Tokei, Z.; List, S.; Beyer, G.Journal ContributionA1
32007High sputter bias super secondary grain growth initiation (In structures)VANSTREELS, Kris ; BRONGERSMA, Sywert; D'HAEN, Jan ; DEMUYNCK, Steven; DE CEUNINCK, Ward ; CALUWAERTS, Rudi; D'OLIESLAEGER, Marc Proceedings PaperC1
42007Microstructural evolution of cu interconnect under AC, pulsed DC and DC current stressBIESEMANS, Leen ; VANSTREELS, Kris ; BRONGERSMA, Sywert; D'HAEN, Jan ; DE CEUNINCK, Ward ; D'OLIESLAEGER, Marc Proceedings PaperC1
52007Increasing the mean grain size in copper films and featuresVANSTREELS, Kris Theses and DissertationsT1
62006Super secondary grain growth initiation in electroplated copperVANSTREELS, Kris ; Brongersma, SH; Demuynck, S; Carbonell, L; D'HAEN, Jan ; DE CEUNINCK, Ward ; D'OLIESLAEGER, Marc ; Maex, KProceedings PaperC1
72006Stress in Next Generation InterconnectsBrongersma, S.H.; Iacopi, F.; VANSTREELS, Kris ; Tökei, Z.; Bruynseraede, C.; Demuynck, S.; D'HAEN, Jan Proceedings PaperC1
82006Influence of grain orientation on the microstructural characterization in cu during (self)-anneal using a surface acoustic wave techniqueSekiguchi, K.; VANSTREELS, Kris ; Demuynck, S.; D'HAEN, Jan ; Brongersma, S.Proceedings PaperC1
92005A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structureVANSTREELS, Kris ; D'OLIESLAEGER, Marc ; DE CEUNINCK, Ward ; D'HAEN, Jan ; Maex, KarenJournal ContributionA1
102004MTF test system with AC based dynamic joule correction for electromigration tests on interconnectsBIESEMANS, Leen ; Schepers, K; VANSTREELS, Kris ; D'HAEN, Jan ; DE CEUNINCK, Ward ; D'OLIESLAEGER, Marc Journal ContributionA1
112004A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structureVANSTREELS, Kris ; D'OLIESLAEGER, Marc ; DE CEUNINCK, Ward ; D'HAEN, Jan ; Maex, KarenProceedings PaperC1
122004Super secondary grain growth in the barrier/seedlayer systemVANSTREELS, Kris ; Brongersma, S.H.; Demuynck, S.; D'HAEN, Jan ; DE CEUNINCK, Ward ; D'OLIESLAEGER, Marc ; Maex, KarenProceedings PaperC1
132003Copper deposition and subsequent grain structure evolution in narrow linesBrongersma, SH; D'HAEN, Jan ; VANSTREELS, Kris ; DE CEUNINCK, Ward ; Vervoort, I; Maex, KProceedings PaperC1