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http://hdl.handle.net/1942/2782
Title: | Copper deposition and subsequent grain structure evolution in narrow lines | Authors: | Brongersma, SH D'HAEN, Jan VANSTREELS, Kris DE CEUNINCK, Ward Vervoort, I Maex, K |
Issue Date: | 2003 | Publisher: | TRANS TECH PUBLICATIONS LTD | Source: | THERMEC'2003, PTS 1-5. p. 2485-2490. | Series/Report: | MATERIALS SCIENCE FORUM | Abstract: | Electroplated copper has become the method of choice for filling narrow interconnect features in the back-end-of-line processing for microelectronics applications. Through the use of additives a void free deposit can be obtained by inducing a filling from the bottom up. However, the accompanying sub-critical grain size results in a recrystallization that proceeds even at room temperature. This process is strongly dependent on plating conditions and the additives used. The resulting differences are studied through line resistivity and real-time SEM grain growth monitoring at elevated temperatures. The present understanding and our efforts to improve it are presented. | Notes: | IMEC, B-3001 Heverlee, Belgium. IMOMEC, B-3590 Diepenbeek, Belgium. Katholieke Univ Leuven, EE Dept, Louvain, Belgium.Brongersma, SH, IMEC, Kapeldreef 75, B-3001 Heverlee, Belgium. | Keywords: | copper; grain growth; real-time SEM | Document URI: | http://hdl.handle.net/1942/2782 | ISI #: | 000183626400398 | Category: | C1 | Type: | Proceedings Paper | Validations: | ecoom 2004 |
Appears in Collections: | Research publications |
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