Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/8184
Title: Super secondary grain growth initiation in electroplated copper
Authors: VANSTREELS, Kris 
Brongersma, SH
Demuynck, S
Carbonell, L
D'HAEN, Jan 
DE CEUNINCK, Ward 
D'OLIESLAEGER, Marc 
Maex, K
Issue Date: 2006
Publisher: MATERIALS RESEARCH SOCIETY
Source: Brongersma, SH Taylor, TC Tsujimura, M Masu, K (Ed.) ADVANCED METALLIZATION CONFERENCE 2005 (AMC 2005). p. 615-621.
Abstract: Super secondary grain growth is initiated in electroplated copper films deposited on thin seed layers on a alpha-Ta barrier layer. Both growth dynamics and self annealing time strongly depend on the copper seed layer bias conditions, barrier bias conditions, barrier composition and the ECD/PVD thickness ratio. This is consistent with an orientation dependent driving force for super grains in an ECD/PVD bi-layer system. The barrier layer seems to play a critical role in the initiation of abnormal SSGG, while strain energy minimization seems to be an important driving force.
Notes: Hasselt Univ, Inst Mat Res, Diepenbeek, B-3590 Belgium.Vanstreels, K, Hasselt Univ, Inst Mat Res, Wetenschapspk 1, Diepenbeek, B-3590 Belgium.
Document URI: http://hdl.handle.net/1942/8184
ISBN: 1-55899-865-9
ISI #: 000236430900087
Category: C1
Type: Proceedings Paper
Validations: ecoom 2007
Appears in Collections:Research publications

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