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http://hdl.handle.net/1942/9047
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DC Field | Value | Language |
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dc.contributor.author | Chew, Alex | - |
dc.contributor.author | Au, Hing Ho | - |
dc.contributor.author | Han, S. H. | - |
dc.contributor.author | Neo, T. L. | - |
dc.contributor.author | Tan, Jackson | - |
dc.contributor.author | Chai, K. W. | - |
dc.contributor.author | Chua, Samuel | - |
dc.date.accessioned | 2008-12-18T08:45:45Z | - |
dc.date.available | 2008-12-18T08:45:45Z | - |
dc.date.issued | 2007 | - |
dc.identifier.citation | IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. p. 195-200. | - |
dc.identifier.issn | 0894-6507 | - |
dc.identifier.uri | http://hdl.handle.net/1942/9047 | - |
dc.description.abstract | Laureen Carbonell received the diploma in chemistry from the Ecole Nationale Superieure de Chimie de Toulouse (ENSCT), France, in 1996, From 1997 until 2000, she carried out her Ph.D. degree in materials science at the Laboratoire de Mineralogic-Cristallographie de Paris (LMCP), France, focusing on the epitaxial growth and characterization of ferromagnetic layers onto ZnSe-based semiconductors. Since 2000; she has been with the Interuniversity Microelectronics Center (IMEC), Leuven, Belgium, where her R&D activity has been focusing on copper electroplating in sub-100-nm interconnects. She has authored and coauthored more than 40 publications | - |
dc.language.iso | en | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.subject.other | via oxide; W plug | - |
dc.title | Watermark-induced high-density via failures in submicron CMOS fabrication (May 2006) | - |
dc.type | Proceedings Paper | - |
local.bibliographicCitation.conferencename | 15th International Symposium on Semiconductor Manufacturing (ISSM) | - |
local.bibliographicCitation.conferenceplace | Tokyo, Japan, SEP 25-27, 2006 | - |
dc.identifier.epage | 200 | - |
dc.identifier.issue | 3 | - |
dc.identifier.spage | 195 | - |
dc.identifier.volume | 20 | - |
local.format.pages | 6 | - |
local.bibliographicCitation.jcat | C1 | - |
dc.description.notes | Interuniv Microelectron Ctr, Louvain, Belgium. Interuniv Microelectron Ctr, Max Planck Inst, Dusseldorf, Germany. Hasselt Univ, Inst Mat Res, Dept Phys, Interuniv Microelectron Ctr, Louvain, Belgium. European Ctr Nucl Res, Italian Natl Inst Nucl Phys, Louvain, Belgium. Interuniv Microelectron Ctr, Louvain, Belgium. Interuniv Microelecton Ctr, Louvain, Belgium. Interuniv Microelectron Ctr, Fund Sci Res Flanders, Louvain, Belgium. | - |
local.type.refereed | Refereed | - |
local.type.specified | Proceedings Paper | - |
dc.bibliographicCitation.oldjcat | C1 | - |
dc.identifier.isi | 000248669800002 | - |
local.bibliographicCitation.btitle | IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | - |
item.fulltext | No Fulltext | - |
item.contributor | Chew, Alex | - |
item.contributor | Au, Hing Ho | - |
item.contributor | Han, S. H. | - |
item.contributor | Neo, T. L. | - |
item.contributor | Tan, Jackson | - |
item.contributor | Chai, K. W. | - |
item.contributor | Chua, Samuel | - |
item.accessRights | Closed Access | - |
item.fullcitation | Chew, Alex; Au, Hing Ho; Han, S. H.; Neo, T. L.; Tan, Jackson; Chai, K. W. & Chua, Samuel (2007) Watermark-induced high-density via failures in submicron CMOS fabrication (May 2006). In: IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. p. 195-200.. | - |
item.validation | ecoom 2008 | - |
Appears in Collections: | Research publications |
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