Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/9047
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dc.contributor.authorChew, Alex-
dc.contributor.authorAu, Hing Ho-
dc.contributor.authorHan, S. H.-
dc.contributor.authorNeo, T. L.-
dc.contributor.authorTan, Jackson-
dc.contributor.authorChai, K. W.-
dc.contributor.authorChua, Samuel-
dc.date.accessioned2008-12-18T08:45:45Z-
dc.date.available2008-12-18T08:45:45Z-
dc.date.issued2007-
dc.identifier.citationIEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. p. 195-200.-
dc.identifier.issn0894-6507-
dc.identifier.urihttp://hdl.handle.net/1942/9047-
dc.description.abstractLaureen Carbonell received the diploma in chemistry from the Ecole Nationale Superieure de Chimie de Toulouse (ENSCT), France, in 1996, From 1997 until 2000, she carried out her Ph.D. degree in materials science at the Laboratoire de Mineralogic-Cristallographie de Paris (LMCP), France, focusing on the epitaxial growth and characterization of ferromagnetic layers onto ZnSe-based semiconductors. Since 2000; she has been with the Interuniversity Microelectronics Center (IMEC), Leuven, Belgium, where her R&D activity has been focusing on copper electroplating in sub-100-nm interconnects. She has authored and coauthored more than 40 publications-
dc.language.isoen-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.subject.othervia oxide; W plug-
dc.titleWatermark-induced high-density via failures in submicron CMOS fabrication (May 2006)-
dc.typeProceedings Paper-
local.bibliographicCitation.conferencename15th International Symposium on Semiconductor Manufacturing (ISSM)-
local.bibliographicCitation.conferenceplaceTokyo, Japan, SEP 25-27, 2006-
dc.identifier.epage200-
dc.identifier.issue3-
dc.identifier.spage195-
dc.identifier.volume20-
local.format.pages6-
local.bibliographicCitation.jcatC1-
dc.description.notesInteruniv Microelectron Ctr, Louvain, Belgium. Interuniv Microelectron Ctr, Max Planck Inst, Dusseldorf, Germany. Hasselt Univ, Inst Mat Res, Dept Phys, Interuniv Microelectron Ctr, Louvain, Belgium. European Ctr Nucl Res, Italian Natl Inst Nucl Phys, Louvain, Belgium. Interuniv Microelectron Ctr, Louvain, Belgium. Interuniv Microelecton Ctr, Louvain, Belgium. Interuniv Microelectron Ctr, Fund Sci Res Flanders, Louvain, Belgium.-
local.type.refereedRefereed-
local.type.specifiedProceedings Paper-
dc.bibliographicCitation.oldjcatC1-
dc.identifier.isi000248669800002-
local.bibliographicCitation.btitleIEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING-
item.fulltextNo Fulltext-
item.validationecoom 2008-
item.accessRightsClosed Access-
item.fullcitationChew, Alex; Au, Hing Ho; Han, S. H.; Neo, T. L.; Tan, Jackson; Chai, K. W. & Chua, Samuel (2007) Watermark-induced high-density via failures in submicron CMOS fabrication (May 2006). In: IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. p. 195-200..-
Appears in Collections:Research publications
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