NIVELLE, Philippe

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Full Name
NIVELLE, Philippe
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philippe.nivelle@uhasselt.be
 
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Publications

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Date Issued:  2018

Results 1-4 of 4 (Search time: 0.001 seconds).

Issue DateTitleContributor(s)TypeCat.
12018Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modulesNIVELLE, Philippe; BORGERS, Tom; Voroshazi, Eszter; POORTMANS, Jef; D'HAEN, Jan; DE CEUNINCK, Ward; DAENEN, MichaelConference MaterialC2
22018Multi-wire interconnection: The impact of the lamination process and the encapsulant properties on the solder joint formationVAN DYCK, Rik; BORGERS, Tom; GOVAERTS, Jonathan; NIVELLE, Philippe; VAN DER HEIDE, Arvid; De Jonge, S.; Voroshazi, Eszter; Szlufcik, Jozef; Van Vuure, Aart Willem; POORTMANS, JefProceedings PaperC1
32018Progress in Encapsulant-Integrated Multi-Wire InterconnectionGOVAERTS, Jonathan; BORGERS, Tom; NIVELLE, Philippe; VAN DYCK, Rik; El-Chami, Ibrahim; Issa, Ibrahim; Hoogewijs, Tom; VAN DER HEIDE, Arvid; Voroshazi, Eszter; Szlufcik, Jozef; POORTMANS, JefProceedings PaperC2
42018Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modulesNIVELLE, Philippe; BORGERS, Tom; Voroshazi, Eszter; POORTMANS, Jef; D'HAEN, Jan; DE CEUNINCK, Ward; DAENEN, MichaelProceedings PaperC1