VAN DYCK, Rik

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Full Name
VAN DYCK, Rik
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rik.vandyck@uhasselt.be
 
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Publications

Results 1-15 of 15 (Search time: 0.005 seconds).

Issue DateTitleContributor(s)TypeCat.
12024Encapsulation strategies for mechanical impact and damp heat reliability improvement of lightweight photovoltaic modules towards vehicle-integrated applicationsLUO, Bin; GOVAERTS, Jonathan; Lisco, Fabiana; Eder, Gabriele; Breukers, Bram; RUTTENS, Bart; D'HAEN, Jan; VAN DYCK, Rik; SIVARAMAKRISHNAN RADHAKRISHNAN, Hariharsudan; Van Vuure, Aart Willem; POORTMANS, JefJournal ContributionA1
22024Development and Investigation of Lightweight Photovoltaics Modules Using Multi-Wire Interconnection Technology against Thermo-mechanical Load towards Vehicle-integrated Photovoltaics ApplicationsLUO, Bin; Hao, Jianqun; GOVAERTS, Jonathan; CASASOLA PAESA, Marta; MARCHAL, Wouter; VAN DYCK, Rik; BORGERS, Tom; SIVARAMAKRISHNAN RADHAKRISHNAN, Hariharsudan; DAENEN, Michael; Van Vuure, Aart W.; POORTMANS, JefProceedings PaperC1
32024Photovoltaic Module-Integrated Capacitors to Facilitate Embedded Power ElectronicsVAN DYCK, Rik; van Nijen, David; Muttillo, Mirco; MANGANIELLO, Patrizio; BAKOVASILIS, Apostolos; BORGERS, Tom; Onda, Kinichi; Zulhidza, Restu; MARTINEZ , Wilmar; SIVARAMAKRISHNAN RADHAKRISHNAN, Hariharsudan; Isabella, Olindo; van Vuure, Aart Willem; POORTMANS, JefProceedings PaperC1
42023Assessment of 3D micro-computed tomography for PV interconnection technology developmentVAN DYCK, Rik; Prapavesis, Alexandros; BORGERS, Tom; GOVAERTS, Jonathan; POORTMANS, Jef; van Vuure, Aart W.Journal ContributionA1
52023Advanced Encapsulants for Reduced Thermal Mechanical Stress in Photovoltaic Modules: A Quantitative Analysis Using FBGSVAN DYCK, Rik; CASASOLA PAESA, Marta; ENGELEN, Tine; LUO, Bin; BORGERS, Tom; GOVAERTS, Jonathan; SIVARAMAKRISHNAN RADHAKRISHNAN, Hariharsudan; DAENEN, Michael; POORTMANS, Jef; van Vuure, Aart WillemProceedings PaperC1
62023Revealing capacitive and inductive effects in modern industrial c-Si photovoltaic cells through impedance spectroscopyvan Nijen, David A.; Muttillo, Mirco; VAN DYCK, Rik; POORTMANS, Jef; Zeman, Miro; Isabella, Olindo; Manganiello, PatrizioJournal ContributionA1
72023Interconnection and lamination technologies towards ubiquitous integration of photovoltaicsGOVAERTS, Jonathan; BORGERS, Tom; LUO, Bin; VAN DYCK, Rik; VAN DER HEIDE, Arvid; REEKMANS, Bart; VASTMANS, Luc; Moors , Reinoud; Doumen, Geert; TOUS, Loic; POORTMANS, JefJournal ContributionA1
82023Development and thermo-mechanical reliability assessment of fiber reinforced polymers in lightweight PV modules towards vehicle-integrated photovoltaicsLUO, Bin; GOVAERTS, Jonathan; VAN DYCK, Rik; BORGERS, Tom; RUTTENS, Bart; CASASOLA PAESA, Marta; D'HAEN, Jan; TOUS, Loic; SIVARAMAKRISHNAN RADHAKRISHNAN, Hariharsudan; DAENEN, Michael; Van Vuure, Aart Willem; POORTMANS, JefJournal ContributionA1
92022Development and testing of light-weight PV modules based on glass-fibre reinforcementGOVAERTS, Jonathan; LUO, Bin; BORGERS, Tom; VAN DYCK, Rik; VAN DER HEIDE, Arvid; TOUS, Loic; Morlier, Arnaud; Lisco, Fabiana; Cerasti, Lorenzo; Galiazzo, Marco; POORTMANS, Jef; Kenny, Robert; Serra, João M.Journal ContributionA1
102021Three-dimensional multi-ribbon interconnection for back-contact solar cellsVAN DYCK, Rik; BORGERS, Tom; GOVAERTS, Jonathan; van Vuure, Aart Willem; POORTMANS, JefJournal ContributionA1
112020Encapsulant-Integrated Interconnection of Bifacial Solar Cells for BIPV Applications: Latest Results in the Twill-BIPV ProjectGOVAERTS, Jonathan; BORGERS, Tom; VAN DYCK, Rik; Andries, Nick; Meyers, Pieter; VAN DER HEIDE, Arvid; Vastmans, Luc; Moors, Reinoud; Doumen, Geert; NIVELLE, Philippe; DAENEN, Michael; Voroshazi, Eszter; Arnett, Chad; Labie, Riet; Van Den Storme, Manuel; Van Den Storme, Guy; Vandebroek, Steven; Schroyen, Peter; Smeers, Kris; Vavilkin, Tatjana; Dewallef, Stefan; Abgrall, Florent; Jousset, Dominique; POORTMANS, JefProceedings PaperC1
122019Woven multi-ribbon interconnection for back-contact cells: Extending the functionality of the encapsulantVAN DYCK, Rik; BORGERS, Tom; GOVAERTS, Jonathan; Voroshazi, Eszter; Van Vuure, Aart Willem; POORTMANS, JefProceedings PaperC1
132019Interconnection 1, 2, 3, 4.0: Buildup towards a PV Technology Hero?BORGERS, Tom; GOVAERTS, Jonathan; VAN DYCK, Rik; El -Chami, Ibrahim; NIVELLE, Philippe; VAN DER HEIDE, Arvid; Doumen, Geert; Bervoets, Robert; Vastmans, Luc; Moors, Reinoud; Manganiello, Patrizio; Voroshazi, Eszter; Szlufcik, Jozef; POORTMANS, JefProceedings PaperC2
142018Progress in Encapsulant-Integrated Multi-Wire InterconnectionGOVAERTS, Jonathan; BORGERS, Tom; NIVELLE, Philippe; VAN DYCK, Rik; El-Chami, Ibrahim; Issa, Ibrahim; Hoogewijs, Tom; VAN DER HEIDE, Arvid; Voroshazi, Eszter; Szlufcik, Jozef; POORTMANS, JefProceedings PaperC2
152018Multi-wire interconnection: The impact of the lamination process and the encapsulant properties on the solder joint formationVAN DYCK, Rik; BORGERS, Tom; GOVAERTS, Jonathan; NIVELLE, Philippe; VAN DER HEIDE, Arvid; De Jonge, S.; Voroshazi, Eszter; Szlufcik, Jozef; Van Vuure, Aart Willem; POORTMANS, JefProceedings PaperC1