Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/42657
Title: Advanced Encapsulants for Reduced Thermal Mechanical Stress in Photovoltaic Modules: A Quantitative Analysis Using FBGS
Authors: VAN DYCK, Rik 
CASASOLA PAESA, Marta 
ENGELEN, Tine 
LUO, Bin 
BORGERS, Tom 
GOVAERTS, Jonathan 
SIVARAMAKRISHNAN RADHAKRISHNAN, Hariharsudan 
DAENEN, Michael 
POORTMANS, Jef 
van Vuure, Aart Willem
Issue Date: 2023
Publisher: IEEE
Source: 2023 IEEE 50TH PHOTOVOLTAIC SPECIALISTS CONFERENCE, PVSC, IEEE, p. 1 -3
Series/Report: IEEE Photovoltaic Specialists Conference
Abstract: In this work, two mini-modules using a 3D multiribbon interconnection are fabricated. One with TPO and the other with glass fiber reinforced TPO (GF TPO) encapsulant. Using fiber Braggs grating sensors (FBGS) attached to the cell, in situ temperature and strain are quantified during reliability tests in the form of thermal cycling from -40 degrees C to +85 degrees C. It was found that the temperature of the cell surface reaches -36 degrees C and +81 degrees C at its minimum and maximum respectively. The measured cell strain followed the same cycling behavior between tension and compression. The strain in the GF TPO based module was found to have a lower peak-to-peak (difference between max tension and compression) value. Also, a consistent difference between strain in parallel and perpendicular directions relative to the busbars was observed, with the latter one being larger.
Notes: Van Dyck, R (corresponding author), Katholieke Univ Leuven, Leuven, Belgium.; Van Dyck, R (corresponding author), Hasselt Univ, Imo Imomec, Hasselt, Belgium.; Van Dyck, R (corresponding author), Imec, Genk, Belgium.; Van Dyck, R (corresponding author), EnergyVille, Genk, Belgium.
Document URI: http://hdl.handle.net/1942/42657
ISBN: 978-1-6654-6059-0
DOI: 10.1109/PVSC48320.2023.10359569
ISI #: 001151676200045
Rights: Copyright 2024 IEEE - All rights reserved.
Category: C1
Type: Proceedings Paper
Appears in Collections:Research publications

Show full item record

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.