Please use this identifier to cite or link to this item:
http://hdl.handle.net/1942/25160| Title: | Ultrasonic bonding of aluminium ribbons to molybdenum back contacted CIGS modules | Authors: | BASHER, Hassan CAROLUS, Jorne Gevaerts, Veronique MEURIS, Marc DAENEN, Michael |
Issue Date: | 2017 | Source: | 9th edition Sunday 2017, Bussum - The Netherlands, 8/10/2017 | Abstract: | The connection of the output terminals of thin film photovoltaic (TFPV) modules with a molybdenum (Mo) back contact is challenging because of the molybdenum diselenide (MoSe2) layer which is formed during the selenization process. MoSe2 is known to be highly resistive and previous research showed that high temperature soldering is not favourable for CIGS. In this work, we present the possibilities of ultrasonic bonding in order to create a low resistive and reliable connection of the output terminals. | Document URI: | http://hdl.handle.net/1942/25160 | Category: | C2 | Type: | Conference Material |
| Appears in Collections: | Research publications |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Ultrasonic bonding of aluminium ribbons to molybdenum back contacted CIGS modules.pdf | Conference material | 1.35 MB | Adobe PDF | View/Open |
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