Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/30567
Title: SoftMod: A Soft Modular Plug-and-Play Kit for Prototyping Electronic Systems
Authors: LAMBRICHTS, Mannu 
TIJERINA MUNOZ, Jose Maria 
RAMAKERS, Raf 
Issue Date: 2020
Publisher: ACM
Source: TEI '20: Proceedings of the Fourteenth International Conference on Tangible, Embedded, and Embodied Interaction, ACM, p. 287 -298
Abstract: We present SoftMod, a novel modular electronics kit consisting of soft and flexible modules that snap together. Unlike existing modular kits, SoftMod tracks the topology of interconnected modules and supports basic plug-and-play behavior as well as advanced user-specified behavior. As such, the shape of a SoftMod assembly does not depend on the desired behavior and various 2D and 3D electronic systems can be realized. While the plug-and-play nature of our modules stimulates play, the advanced features for specifying behavior and for making a variety of soft and flexible shapes, offer a high-ceiling when experimenting with novel types of interfaces, such as wearables, and interactive skin and textiles. CCS CONCEPTS • Human-centered computing → User interface toolkits. Figure 1: (a) snapping together SoftMods to (b) prototype an interactive armband.
Keywords: Electronic Toolkit;Sensor Systems;Prototyping;Physical Computing
Document URI: http://hdl.handle.net/1942/30567
ISBN: 9781450361071
DOI: 10.1145/3374920.3374950
ISI #: WOS:000570009800026
Rights: Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than the author(s) must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from permissions@acm.org. TEI ’20, February 9–12, 2020, Sydney, NSW, Australia © 2020 Copyright held by the owner/author(s). Publication rights licensed to ACM.
Category: C1
Type: Proceedings Paper
Validations: ecoom 2022
Appears in Collections:Research publications

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