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http://hdl.handle.net/1942/43398| Title: | Ultrasonic Al Bond on Mo Back-Contact Layer of CIGS Solar Panel Characterization Using Infinite Focus Microscope (IFM) and Micro-Ohmmeter | Authors: | Hamid, Sabarina Abdul Zulkifli, Muhammad Nubli Jalar, Azman Jusoh, Wan Nursheila Wan Abu Bakar, Maria BASHER, Hassan DAENEN, Michael |
Issue Date: | 2024 | Publisher: | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | Source: | IEEE Transactions on Components Packaging and Manufacturing Technology, 14 (6) , p. 1123 -1133 | Keywords: | Bonding;Acoustics;Deformation;Morphology;Surface morphology;Solar panels;Ultrasonic variables measurement;Copper indium gallium (de) selenide (CIGS);deformation;Mo back-contact layer;ultrasonic Al bond;ultrasonic bonding mechanisms | Document URI: | http://hdl.handle.net/1942/43398 | ISSN: | 2156-3950 | e-ISSN: | 2156-3985 | DOI: | 10.1109/TCPMT.2024.3393917 | ISI #: | 001259646200013 | Category: | A1 | Type: | Journal Contribution |
| Appears in Collections: | Research publications |
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