DE CEUNINCK, Ward

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DE CEUNINCK, Ward
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ward.deceuninck@uhasselt.be
 
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Author:  Maex, K

Results 1-9 of 9 (Search time: 0.002 seconds).

Issue DateTitleContributor(s)TypeCat.
12006Super secondary grain growth initiation in electroplated copperVANSTREELS, Kris; Brongersma, SH; Demuynck, S; Carbonell, L; D'HAEN, Jan; DE CEUNINCK, Ward; D'OLIESLAEGER, Marc; Maex, KProceedings PaperC1
22003Copper deposition and subsequent grain structure evolution in narrow linesBrongersma, SH; D'HAEN, Jan; VANSTREELS, Kris; DE CEUNINCK, Ward; Vervoort, I; Maex, KProceedings PaperC1
32000In-situ SEM observation of electromigration in thin metal films at accelerated stress conditionsD'HAEN, Jan; VAN OLMEN, Jan; BEELEN, Zjef; MANCA, Jean; MARTENS, Tom; DE CEUNINCK, Ward; D'OLIESLAEGER, Marc; DE SCHEPPER, Luc; Cannaerts, M; Maex, KJournal ContributionA1
41999The kinetics of the early stages of electromigration and concurrent temperature induced processes in thin film metallisations studied by means of an in-situ high resolution resistometric techniqueVAN OLMEN, Jan; MANCA, Jean; DE CEUNINCK, Ward; DE SCHEPPER, Luc; D'Haeger, V; Witvrouw, A; Maex, K; Vandevelde, B; Beyne, E; Tielemans, LJournal Contribution
51999Dynamics of electromigration induced void/hillock growth and precipitation/dissolution of addition elements studied by in-situ scanning electron microscopy resistance measurementsD'HAEN, Jan; COSEMANS, Patrick Peter; MANCA, Jean; LEKENS, Geert; MARTENS, Tom; DE CEUNINCK, Ward; D'OLIESLAEGER, Marc; DE SCHEPPER, Luc; Maex, KJournal Contribution
61998The dependence of stress induced voiding on line width studied by conventional and high resolution resistance measurementsWitvrouw, A; Maex, K; DE CEUNINCK, Ward; LEKENS, Geert; D'HAEN, Jan; DE SCHEPPER, LucJournal Contribution
71998The influence of addition elements on the early resistance changes observed during electromigration testing of Al metal linesDE CEUNINCK, Ward; D'Haeger, V; VAN OLMEN, Jan; Witvrouw, A; Maex, K; DE SCHEPPER, Luc; De Pauw, P; Pergoot, AJournal Contribution
81998Overview of the kinetics of the early stages of electromigration under low (= realistic) current density stressVAN OLMEN, Jan; MANCA, Jean; DE CEUNINCK, Ward; DE SCHEPPER, Luc; D'Haeger, V; Witvrouw, A; Maex, KJournal Contribution
91998Study of Cu diffusion in an Al-1 wt%Si-0.5 wt%Cu bond pad with an Al-1 wt%Si bond wire attached using scanning electron microscopyCOSEMANS, Patrick; D'HAEN, Jan; Witvrouw, A; Proost, J; D'OLIESLAEGER, Marc; DE CEUNINCK, Ward; Maex, K; DE SCHEPPER, LucJournal Contribution