NIVELLE, Philippe

Full Name
NIVELLE, Philippe
Email
philippe.nivelle@uhasselt.be
 
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Publications

Results 1-12 of 12 (Search time: 0.004 seconds).

Issue DateTitleContributor(s)TypeCat.
12025Multi-scale, multiphysics modelling and characterization of photovoltaic systems: a co-development approachNIVELLE, PhilippeTheses and DissertationsT1
22024Investigation of static and dynamic mechanical loads on light-weight PV modules for offshore floating applicationsKYRANAKI, Nikoleta; NIVELLE, Philippe; BOUGUERRA, Sara; CASASOLA PAESA, Marta; DE JONG, Richard; Delbeke, Oscar; Spannan, Lars; VAN DER HEIDE, Arvid; KAAYA, Ismail; Moschner, Jens; MORLIER, Arnaud; DAENEN, MichaelJournal ContributionA1
32023In situ quantification of temperature and strain within photovoltaic modules through optical sensingNIVELLE, Philippe; MAES, Lowie; POORTMANS, Jef; DAENEN, MichaelJournal ContributionA1
42023Towards light-weight and mechanically durable photovoltaic modules for floating applicationsKYRANAKI, Nikoleta; NIVELLE, Philippe; CASASOLA PAESA, Marta; DE JONG, Richard; Spannan, Lars; VAN DER HEIDE, Arvid; KAAYA, Ismail; BOUGUERRA, Sara; Moschner, Jens; DAENEN, MichaelConference MaterialC2
52021Introducing a Thermal-Based Method for Measuring Dynamic Thin Film Thickness in Real Time as a Tool for Sensing ApplicationsOUDEBROUCKX, Gilles; VANDENRYT, Thijs; NIVELLE, Philippe; BORMANS, Seppe; WAGNER, Patrick; THOELEN, RonaldJournal ContributionA1
62020The Sensitivity of an Electro-Thermal Photovoltaic DC–DC Converter Model to the Temperature Dependence of the Electrical Variables for Reliability AnalysesVAN DE SANDE, Wieland; Ravyts, Simon; ALAVI, Omid; NIVELLE, Philippe; Driesen, Johan; DAENEN, MichaelJournal ContributionA1
72020Layer Morphology and Ink Compatibility of Silver Nanoparticle Inkjet Inks for Near-Infrared SinteringREENAERS, Dieter; MARCHAL, Wouter; Biesmans, Ianto; NIVELLE, Philippe; D'HAEN, Jan; DEFERME, WimJournal ContributionA1
82020Thermo-Mechanical Stress Comparison of a GaN and SiC MOSFET for Photovoltaic ApplicationsVAN DE SANDE, Wieland; ALAVI, Omid; NIVELLE, Philippe; D'HAEN, Jan; DAENEN, MichaelJournal ContributionA1
92019Interconnection 1, 2, 3, 4.0: Buildup towards a PV Technology Hero?BORGERS, Tom; GOVAERTS, Jonathan; VAN DYCK, Rik; El -Chami, Ibrahim; NIVELLE, Philippe; VAN DER HEIDE, Arvid; Doumen, Geert; Bervoets, Robert; Vastmans, Luc; Moors, Reinoud; Manganiello, Patrizio; Voroshazi, Eszter; Szlufcik, Jozef; POORTMANS, JefProceedings PaperC2
102018Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modulesNIVELLE, Philippe; BORGERS, Tom; Voroshazi, Eszter; POORTMANS, Jef; D'HAEN, Jan; DE CEUNINCK, Ward; DAENEN, MichaelConference MaterialC2
112018Progress in Encapsulant-Integrated Multi-Wire InterconnectionGOVAERTS, Jonathan; BORGERS, Tom; NIVELLE, Philippe; VAN DYCK, Rik; El-Chami, Ibrahim; Issa, Ibrahim; Hoogewijs, Tom; VAN DER HEIDE, Arvid; Voroshazi, Eszter; Szlufcik, Jozef; POORTMANS, JefProceedings PaperC2
122018Multi-wire interconnection: The impact of the lamination process and the encapsulant properties on the solder joint formationVAN DYCK, Rik; BORGERS, Tom; GOVAERTS, Jonathan; NIVELLE, Philippe; VAN DER HEIDE, Arvid; De Jonge, S.; Voroshazi, Eszter; Szlufcik, Jozef; Van Vuure, Aart Willem; POORTMANS, JefProceedings PaperC1