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http://hdl.handle.net/1942/25159| Title: | Proposing a model to investigate the impact of interconnectiontechnology on shading damage by TFPV modules | Authors: | CAROLUS, Jorne VAN DE SANDE, Wieland Vandenbergh, Thomas Bakker, Klaas MEURIS, Marc DAENEN, Michael |
Issue Date: | 2017 | Source: | 9th edition Sunday 2017, Bussum - The Netherlands, 8/10/2017 | Abstract: | Recent studies show that thin film photovoltaics (TFPV) are prone to shading damage. When one cell in a TFPV module is shaded, the other cells connected in series will push the current in reverse through the shaded cell. This creates hot spots and eventually breakdown when the power of the other cells in series connected is sufficient. In this poster, we present a model which can be used to determine the impact of interconnection technology on shading damage by TFPV modules. | Document URI: | http://hdl.handle.net/1942/25159 | Category: | C2 | Type: | Conference Material |
| Appears in Collections: | Research publications |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 2017_10_31_VanDeSande_TFPV.pdf | Conference material | 578.19 kB | Adobe PDF | View/Open |
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