Moisture induced failures in flip chip on flex interconnections using anisotropic conductive adhesives

Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/6915

Title:	Moisture induced failures in flip chip on flex interconnections using anisotropic conductive adhesives
Authors:	LEKENS, Geert DREESEN, Raf CROES, Kristof Caers, J.F.J.M. Zhao, X.J. Wong, E.H.
Issue Date:	2003
Source:	Proceedings of the International IEEE Conference on the Business of Electronic Product Reliability and Liability, Hong KOng and Shenhzen, China, January 13-17. p. 13-17.
Document URI:	http://hdl.handle.net/1942/6915
Category:	C2
Type:	Proceedings Paper
Appears in Collections:	Research publications

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