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http://hdl.handle.net/1942/6915| Title: | Moisture induced failures in flip chip on flex interconnections using anisotropic conductive adhesives | Authors: | LEKENS, Geert DREESEN, Raf CROES, Kristof Caers, J.F.J.M. Zhao, X.J. Wong, E.H. |
Issue Date: | 2003 | Source: | Proceedings of the International IEEE Conference on the Business of Electronic Product Reliability and Liability, Hong KOng and Shenhzen, China, January 13-17. p. 13-17. | Document URI: | http://hdl.handle.net/1942/6915 | Category: | C2 | Type: | Proceedings Paper |
| Appears in Collections: | Research publications |
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