Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/6915
Title: Moisture induced failures in flip chip on flex interconnections using anisotropic conductive adhesives
Authors: LEKENS, Geert 
DREESEN, Raf 
CROES, Kristof 
Caers, J.F.J.M.
Zhao, X.J.
Wong, E.H.
Issue Date: 2003
Source: Proceedings of the International IEEE Conference on the Business of Electronic Product Reliability and Liability, Hong KOng and Shenhzen, China, January 13-17. p. 13-17.
Document URI: http://hdl.handle.net/1942/6915
Category: C2
Type: Proceedings Paper
Appears in Collections:Research publications

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