DAENEN, Michael

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Full Name
DAENEN, Michael
Email
michael.daenen@uhasselt.be
 
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Publications

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Date Issued:  [2010 TO 2019]
Type:  Conference Material

Results 1-11 of 11 (Search time: 0.003 seconds).

Issue DateTitleContributor(s)TypeCat.
12019Investigating the degradation kinetics of c-Si and CIGS solar cells under potential induced degradation by various material characterization techniquesPUROHIT, Zeel; CAROLUS, Jorne; Chaliyawala, Harsh; Kumar, Manoj; Jain, Shubhendra; Gundimeda, Abhiram; Agrawal, Neha; Gupta, Govind; DAENEN, Michael; Tripathi, BrijeshConference MaterialC2
22018Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modulesNIVELLE, Philippe; BORGERS, Tom; Voroshazi, Eszter; POORTMANS, Jef; D'HAEN, Jan; DE CEUNINCK, Ward; DAENEN, MichaelConference MaterialC2
32017Impact of potential-induced degradation (PID) on PV parametersCAROLUS, Jorne; Govaerts, Jonathan; Voroshazi, Eszter; DE CEUNINCK, Ward; DAENEN, MichaelConference MaterialC2
42017Ultrasonic bonding of aluminium ribbons to molybdenum back contacted CIGS modulesBASHER, Hassan; CAROLUS, Jorne; Gevaerts, Veronique; MEURIS, Marc; DAENEN, MichaelConference MaterialC2
52017Ultrasonic bonding of aluminium ribbons to molybdenum back contacted CIGS modulesBASHER, Hassan; CAROLUS, Jorne; Gevaerts, Veronique; MEURIS, Marc; DAENEN, MichaelConference MaterialC2
62017Proposing a model to investigate the impact of interconnectiontechnology on shading damage by TFPV modulesCAROLUS, Jorne; VAN DE SANDE, Wieland; Vandenbergh, Thomas; Bakker, Klaas; MEURIS, Marc; DAENEN, MichaelConference MaterialC2
72017Mechanical Sensitivity analysis of a sub cell using wire interconnectionNIVELLE, Philippe; DAENEN, Michael; BORGERS, Tom; GOVAERTS, Jonathan; Vörösházi, E.; POORTMANS, JefConference MaterialC2
82017Thermo-mechanical finite element simulation of a sub-cell utilising wire interconnectionNIVELLE, Philippe; DAENEN, Michael; Vörösházi E.; D'HAEN, Jan; POORTMANS, JefConference MaterialC2
92017Expansion of the mechanical sub cell model with interface parameters provided by mechanical testingNIVELLE, Philippe; BORGERS, Tom; GOVAERTS, Jonathan; VAN DER HEIDE, Arvid; DAENEN, Michael; Singh, S.; Pedreira, O; DESTA, Derese; Horváth T., I; Vörösházi, E.; POORTMANS, JefConference MaterialC2
102016Spatial heat distribution of inkjet printed heaters in comparison to planar milled circuit board heaters for biosensing applicationsCAROLUS, Jorne; VANDENRYT, Thijs; VANDEVENNE, Glen; DEFERME, Wim; THOELEN, Ronald; DAENEN, MichaelConference MaterialC2
112016Potential-induced degradation (PID); A test campaign at module levelCAROLUS, Jorne; DAENEN, MichaelConference MaterialC2